Organosilyl polysulfides, and rubber mixtures containing same
US-2024239990-A1 · Jul 18, 2024 · US
US9309373B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9309373-B2 |
| Application number | US-201113996858-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 2, 2011 |
| Priority date | Dec 28, 2010 |
| Publication date | Apr 12, 2016 |
| Grant date | Apr 12, 2016 |
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Provided is an adhesive composition leading to sufficient adhesive strength when used for bonding to a polyolefin resin molded article that bonds poorly with other members. Also provided is an adhesive composition having excellent heat resistance (heat resistant adhesion) in the bonded part of a composite body obtained by joining a polyolefin resin-formed body and other member. This adhesive composition contains an organic solvent, a carboxyl group-containing polyolefin resin which is dissolved in this organic solvent and which has a melt flow rate of 5 to 40 g/10 min when measured at 130° C., and a polyfunctional isocyanate compound. This adhesive composition may further contain a carboxyl group-containing polyolefin resin having a melting point of 120° C. to 170° C.
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What is claimed is: 1. An adhesive composition, comprising: an organic solvent, a polyolefin resin A that is dissolved in the organic solvent, and a polyfunctional isocyanate compound, wherein the polyolefin resin A has a melt flow rate measured at 130° C. of 5 to 40 g/10 min, and comprises a carboxyl group, and wherein the polyolefin resin A has a melting point of 84° C. to 90° C. 2. The adhesive composition according to claim 1 , wherein a content of the carboxyl group in the polyolefin resin A is in a range of from 0.01 to 2.0 mmol based on 1 g of the polyolefin resin A. 3. The adhesive composition according to claim 2 , further comprising a polyolefin resin B that has a melting point of from 120° C. to 170° C., and comprises a carboxyl group. 4. The adhesive composition according to claim 3 , wherein a content of the carboxyl group in the polyolefin resin B is in a range of from 0.01 to 2.0 mmol based on 1 g of the polyolefin resin B. 5. The adhesive composition according to claim 3 , wherein the polyolefin resin B is insoluble in the organic solvent, and an average particle size of the polyolefin resin B is of from 1 to 50 μm. 6. The adhesive composition according to claim 3 , wherein a content of the polyolefin resin A and a content of the polyolefin resin B are respectively 1% to 70% by mass and 30% to 99% by mass based on 100% by mass of a total amount of the polyolefin resin A and the polyolefin resin B. 7. The adhesive composition according to claim 1 , further comprising a polyolefin resin B that has a melting point of from 120° C. to 170° C., and comprises a carboxyl group. 8. The adhesive composition according to claim 7 , wherein a content of the carboxyl group in the polyolefin resin B is from 0.01 to 2.0 mmol based on 1 g of the polyolefin resin B. 9. The adhesive composition according claim 7 , wherein the polyolefin resin B is insoluble in the organic solvent and has an average particle size of from 1 to 50 μm. 10. The adhesive composition according to claim 7 , wherein a content of the polyolefin resin A and a content of the polyolefin resin B are respectively 1% to 70% by mass and 30% to 99% by mass based on 100% by mass of a total amount of the polyolefin resin A and the polyolefin resin B. 11. A thermally adhesive member comprising an adhesive layer obtained by a process comprising curing the adhesive composition according to claim 1 , wherein a metal layer is bonded to one side of the adhesive layer, and a thermally adhesive resin layer is bonded to the other side of the adhesive layer.
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