Electronic substrate with heat dissipation structure

Patent metadata

Field	Value
Publication number	US-9535470-B2
Application number	US-201414322906-A
Country	US
Kind code	B2
Filing date	Jul 2, 2014
Priority date	Jul 2, 2014
Publication date	Jan 3, 2017
Grant date	Jan 3, 2017

Abstract

An electronic substrate with heat dissipation structure includes a substrate plate and at least one heat pipe. The substrate plate includes a wiring layer, a grounding layer and an insulation layer from top to bottom. The wiring layer has at least one heat-producing element mounted thereon, and is formed with a receiving hole for the heat pipe to tightly fit therein. Heat produced by the heat-producing element and distributed over a high-temperature zone of the substrate plate surrounding the heat-producing element is absorbed by the heat pipe and then transferred to a low-temperature zone of the substrate plate distant from the heat-producing element, from where the heat is dissipated into ambient air to achieve cooling effect at upgraded heat dissipation efficiency.

First claim

What is claimed is:

1. An electronic substrate with heat dissipation structure, comprising: a substrate plate including a wiring layer, a grounding layer and an insulation layer; the wiring layer having a first side surface and an opposite second side surface, and being provided with a receiving hole; the first side surface having at least one heat-producing element mounted thereon, and the receiving hole provided on the wiring layer being extended from a position in the vicinity of the heat-producing element to another position distant from the heat-producing element while vertically extending through the first and the second side surface of the wiring layer; the grounding layer having an upper side facing toward the wiring layer and attached to the second side surface, and a lower side facing away from the wiring layer; and
the insulation layer having an upper side facing toward and attached to the lower side of the grounding layer, and a lower side facing away from the grounding layer; and
a heat pipe having an upper surface and a lower surface being tightly fitted in the entire receiving hole with the entire lower surface of the heat pipe in full contact with the upper side of the grounding layer; the heat pipe including a heat-absorption section and a heat-transfer section extended from the heat-absorption section; the heat-absorption section being fitted in a portion of the receiving hole located adjacent to the heat-producing element, and the heat-transfer section being fitted in another portion of the receiving hole located distant from the heat-producing element; wherein the upper surface and the lower surface of the heat pipe are flush with the first side surface and the second side surface of the wiring layer, respectively.

2. The electronic substrate with heat dissipation structure as claimed in claim 1 , wherein areas of the wiring layer that surround the heat-producing element form at least one high-temperature zone, and other areas of the wiring layer that are located farther away from the heat-producing element form a low-temperature zone; and the heat-absorption section of the heat pipe being located in the high-temperature zone while the heat-transfer section being located in the low-temperature zone.

3. The electronic substrate with heat dissipation structure as claimed in claim 2 , wherein the heat-absorption section of the heat pipe is fitted in a portion of the receiving hole located adjacent to one side of the heat-producing element, and both of the heat-absorption section and the heat-transfer section have a lower surface in full contact with the upper side of the grounding layer.

Assignees

• Asia Vital Components Co Ltd

Inventors

• Wu Chun-Ming

Classifications

• H05K1/0272

  Adaptations for fluid transport, e.g. channels, holes · CPC title

• H05K1/0203

  Cooling of mounted components (H05K1/0272 takes precedence) · CPC title

• G06F1/203 Primary

  for portable computers, e.g. for laptops · CPC title