Mobile electronic device and methods of manufacture thereof

US9274568B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9274568-B2
Application numberUS-201313962605-A
CountryUS
Kind codeB2
Filing dateAug 8, 2013
Priority dateAug 8, 2013
Publication dateMar 1, 2016
Grant dateMar 1, 2016

How to read this patent

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Disclosed herein is a mobile device comprising a plate; the plate being adapted to accommodate a printed circuit board; a ring bonded to the plate; a seal disposed between the ring and the plate, the plate and ring and seal forming a mid-plate structure; wherein the seal comprises a platform; and a housing unit bonded to the platform.

First claim

Opening claim text (preview).

What is claimed is: 1. A mobile device comprising: a plate; the plate being adapted to accommodate a printed circuit board; a ring bonded to the plate via a plurality of attachment points, wherein the attachment points partially define a plurality of void-spaces between the ring and the plate; a seal disposed within the void-spaces, the plate and ring and seal forming a mid-plate structure; wherein the seal comprises a platform; and a housing unit bonded to the platform. 2. The mobile device of claim 1 , wherein the ring and the plate include steel, and wherein the ring is bonded to the plate with a weld. 3. The mobile device of claim 1 , wherein the plate is rectangular having two long sides, and wherein the ring is rectangular having two long sides, and wherein one of the long sides of the ring is bonded to one of the long sides of the plate. 4. The mobile device of claim 1 , wherein the platform is a first platform, the seal further comprising a second platform, wherein the first platform and the second platform face mutually opposed directions; the mobile device further comprising a display unit bonded to the second platform. 5. The mobile device of claim 1 , wherein the seal comprises a polymer and wherein the housing unit comprises a polymeric rim, and wherein the polymeric rim of the housing unit is bonded to the platform of the seal with laser welding. 6. The mobile device of claim 1 , where the seal comprises an elastomer. 7. The mobile device of claim 4 , where the bond between the housing unit and the first platform and the bond between the display unit and the second platform are adhesive bonds. 8. The mobile device of claim 1 , where the bond between the housing unit and the platform is accomplished with laser welding. 9. The mobile device of claim 1 , where the housing unit comprises a metal or a polymer. 10. The mobile device of claim 1 , where the mobile device is a smart phone, a tablet, a handheld computer, a mobile internet device, a wearable computer, a personal digital assistant, a handheld gaming console, a personal navigation device, a smart watch, a head mounted display, a calculator or a portable media player. 11. The mobile device of claim 1 , further comprising one or more of a mobile communication module, a wireless internet module, a short range communication module, a location information module, an audio-visual input unit comprising a camera and/or a microphone; a sensing unit comprising a proximity sensor; and a memory.

Assignees

Inventors

Classifications

  • Details of the structure or mounting of specific components · CPC title

  • for a printed circuit board assembly · CPC title

  • Details related to the display arrangement, including those related to the mounting of the display in the housing · CPC title

  • G06F1/182Primary

    with special features, e.g. for use in industrial environments; grounding or shielding against radio frequency interference [RFI] or electromagnetical interference [EMI] · CPC title

  • H04M1/0249Primary

    Details of the mechanical connection between the housing parts or relating to the method of assembly · CPC title

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Frequently asked questions

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What does patent US9274568B2 cover?
Disclosed herein is a mobile device comprising a plate; the plate being adapted to accommodate a printed circuit board; a ring bonded to the plate; a seal disposed between the ring and the plate, the plate and ring and seal forming a mid-plate structure; wherein the seal comprises a platform; and a housing unit bonded to the platform.
Who is the assignee on this patent?
Blackberry Ltd
What technology area does this patent fall under?
Primary CPC classification G06F1/182. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Mar 01 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).