Nozzle and substrate treating apparatus including the same

US10005092B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10005092-B2
Application numberUS-201615223931-A
CountryUS
Kind codeB2
Filing dateJul 29, 2016
Priority dateJul 31, 2015
Publication dateJun 26, 2018
Grant dateJun 26, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A nozzle for supplying a fluid to a substrate, the nozzle including a body having a liquid discharge line through which the liquid flows and a gas discharge line that surrounds the liquid discharge line and through which a gas flow, wherein the body includes a plurality of liquid discharge holes that discharge the liquid flowing through the liquid discharge line, and a gas discharge hole that discharges the gas flowing through the gas discharge line.

First claim

Opening claim text (preview).

What is claimed is: 1. A nozzle for supplying a fluid to a substrate, the nozzle comprising: a body having a liquid discharge line for flow of liquid therethrough and a gas discharge line that surrounds the liquid discharge line for flow of a gas therethrough, wherein the body comprises: a plurality of liquid discharge holes for discharge of liquid flow through the liquid discharge line; and a gas discharge hole for discharge of gas flow through the gas discharge line, wherein the liquid discharge holes are arranged to surround a central axis of the liquid discharge line, wherein the liquid discharge holes are parallel to the central axis of the liquid discharge line, wherein the gas discharge line comprises an outlet line through which the gas is discharged to the outside, wherein a cross-sectional area of the outlet line becomes wider as the outlet line extends downwards and wherein the outlet line is inclined downwards in a direction that faces the central axis of the liquid discharge line such that the gas is discharged towards the central axis. 2. The nozzle of claim 1 , wherein the gas discharge line further comprises: an inlet line through which the gas is introduced; and a middle line that connects the inlet line and the outlet line, wherein the inlet line is inclined downwards in a direction that faces the central axis of the liquid discharge line. 3. The nozzle of claim 2 , wherein an outer surface of the outlet line extends parallel to an outer surface of the middle line. 4. The nozzle of claim 1 , wherein an inner surface of the outlet line forms an acute angle with respect to the central axis of the liquid discharge line. 5. The nozzle of claim 1 , wherein an inner surface of the outlet line forms an angle of 60 to 70 degrees with respect to the central axis of the liquid discharge line. 6. The nozzle of claim 1 , wherein an outer surface of the outlet line is parallel to a central axis of the liquid discharge line. 7. The nozzle of claim 1 , wherein the liquid discharge holes and the gas discharge hole are spaced apart from each other, and a distance between each of the liquid discharge holes and the gas discharge hole is not more than 0.5 mm. 8. The nozzle of claim 1 , wherein a diameter of each of the liquid discharge holes is not more than 500 μm. 9. The nozzle of claim 1 , wherein each of the liquid discharge holes has a circular shape, and the gas discharge hole has an annular ring shape. 10. The nozzle of claim 1 , further comprising: a buffer to prevent gas from being discharged while being biased, wherein the buffer comprises: a flange that protrudes from an outer surface of the liquid discharge line; and a plurality of grooves that are vertically formed along a circumference of the flange, and wherein the grooves are inclined from an outer peripheral surface of the flange to an inside of the flange, and inclined downwards with a vertical direction of the flange. 11. An apparatus for treating a substrate, the apparatus comprising: a cup providing a treatment space for treating the substrate; a support unit disposed in the treatment space to support the substrate in the treatment space; and an injection unit that has a nozzle for discharging a fluid to the substrate, wherein the nozzle comprises: a body having a liquid discharge line through which the liquid flows and a gas discharge line that surrounds the liquid discharge line and through which a gas flows, and wherein the body comprises: a plurality of liquid discharge holes that discharge the liquid flowing through the liquid discharge line; and a gas discharge hole that discharges the gas flowing through the gas discharge line, wherein the liquid discharge holes are arranged to surround a central axis of the liquid discharge line, wherein the liquid discharge holes are parallel to the central axis of the liquid discharge line, wherein the gas discharge line comprises an outlet line through which the gas is discharged to the outside, wherein a cross-sectional area of the outlet line becomes wider as the outlet line extends downwards and wherein the outlet line is inclined downwards in a direction that faces the central axis of the liquid discharge line such that the gas is discharged towards the central axis. 12. The apparatus of claim 11 , wherein the gas discharge line further comprises: an inlet line through which gas can be introduced; and a middle line that connects the inlet line and the outlet line, wherein the inlet line is inclined downwards in a direction that faces the central axis of the liquid discharge line. 13. The apparatus of claim 12 , wherein an outer surface of the outlet line extends parallel to an outer surface of a middle line. 14. The apparatus of claim 11 , wherein an inner surface of the outlet line is inclined at an acute angle with respect to a central axis of the liquid discharge line. 15. The apparatus of claim 11 , wherein an inner surface of the outlet line forms an angle of 60 to 70 degrees with respect to the central axis of the liquid discharge line to be inclined downwards. 16. The apparatus of claim 11 , wherein the outer surface of the outlet line is parallel to the central axis of the liquid discharge line. 17. The apparatus of claim 11 , wherein the liquid discharge holes and the gas discharge hole are spaced apart from each other, and a distance between the liquid discharge hole and each of the gas discharge holes is not more than 0.5 mm. 18. The apparatus of claim 11 , wherein a diameter of each of the liquid discharge holes is not more than 500 μm. 19. The apparatus of claim 11 , wherein each of the liquid discharge holes has a circular shape, and the gas discharge hole has an annular ring shape. 20. The apparatus of claim 11 , wherein the nozzle further comprises: a buffer to prevent gas from being discharged while being biased, wherein the buffer comprises: a flange that protrudes from an outer surface of the liquid discharge line; and a plurality of grooves that are vertically formed along a circumference of the flange, and wherein the grooves are inclined from an outer peripheral surface of the flange to the inside of the flange, and is inclined downwards with a vertical direction of the flange.

Assignees

Inventors

Classifications

  • using mainly spraying means, e.g. nozzles · CPC title

  • for applying liquid or other fluent material to separate articles (B05C5/0204 takes precedence) · CPC title

  • B05B7/10Primary

    producing a swirling discharge · CPC title

  • with at least one gas jet intersecting a jet constituted by a liquid or a mixture containing a liquid for controlling the shape of the latter · CPC title

  • with several liquid outlets discharging one or several liquids · CPC title

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What does patent US10005092B2 cover?
A nozzle for supplying a fluid to a substrate, the nozzle including a body having a liquid discharge line through which the liquid flows and a gas discharge line that surrounds the liquid discharge line and through which a gas flow, wherein the body includes a plurality of liquid discharge holes that discharge the liquid flowing through the liquid discharge line, and a gas discharge hole that d…
Who is the assignee on this patent?
Semes Co Ltd
What technology area does this patent fall under?
Primary CPC classification H10P72/0414. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Jun 26 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).