Interposer and semiconductor package including the same
US-11705391-B2 · Jul 18, 2023 · US
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Yoon Min-Seung patents
Yoon Min-Seung is listed as an inventor on 6 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Yoon Min-Seung |
| Total patents | 6 |
| First publication | May 17, 2016 |
| Latest publication | Jul 18, 2023 |
Notable patents
Publications ranked by popularity score, then publication date.
Interposer and semiconductor package including the same
US-2021265258-A1 · Aug 26, 2021 · US
Interposer and semiconductor package including the same
US-11081440-B2 · Aug 3, 2021 · US
Interposer and semiconductor package including the same
US-2020312760-A1 · Oct 1, 2020 · US
Semiconductor device, fabricating method thereof and semiconductor package including the semiconductor device
US-9941196-B2 · Apr 10, 2018 · US
Semiconductor device, fabricating method thereof and semiconductor package including the semiconductor device
US-9343361-B2 · May 17, 2016 · US
Recent patents
Latest publications not already listed above.
No data yet.
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Samsung Electronics Co Ltd | 6 |
| Lee Ho Jin | 1 |
| Cho Tae Je | 1 |
| Jang Dong Hyeon | 1 |
| Song Ho Geon | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/00 | 6 |
| H10W70/635 | 6 |
| H10W20/49 | 6 |
| H10W20/20 | 6 |
| H10W90/297 | 6 |