3D NAND memory device with isolation trenches and fabrication method thereof
US-12598965-B2 · Apr 7, 2026 · US
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Yao Lan patents
Yao Lan is listed as an inventor on 58 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Yao Lan |
| Total patents | 58 |
| First publication | Mar 14, 2019 |
| Latest publication | Apr 7, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
3d memory device
US-2026082555-A1 · Mar 19, 2026 · US
Semiconductor device having shallow trench isolation structures and fabrication method thereof
US-12550690-B2 · Feb 10, 2026 · US
Semiconductor device including reduced-size transistors, manufacturing method thereof, and NAND memory device
US-12543319-B2 · Feb 3, 2026 · US
3D memory device
US-12507406-B2 · Dec 23, 2025 · US
Semiconductor devices and methods for manufacturing the same, and NAND memory devices
US-12446265-B2 · Oct 14, 2025 · US
Semiconductor device, three-dimensional memory and method for fabricating the semiconductor device
US-12439605-B2 · Oct 7, 2025 · US
Semiconductor structure, fabrication method and three-dimensional memory
US-12376307-B2 · Jul 29, 2025 · US
Semiconductor structure, fabrication method and three-dimensional memory
US-12362223-B2 · Jul 15, 2025 · US
Phase shifter, base station antenna, and base station
US-2025226577-A1 · Jul 10, 2025 · US
Recent patents
Latest publications not already listed above.
Semiconductor device and manufacture method thereof
US-12324198-B2 · Jun 3, 2025 · US
Semiconductor devices and methods for fabricating the same
US-2025079236-A1 · Mar 6, 2025 · US
Staircase structure for memory device
US-2025031366-A1 · Jan 23, 2025 · US
Three-dimensional memory devices with reduced cell interference and fabrication methods thereof
US-12185536-B2 · Dec 31, 2024 · US
Semiconductor devices and methods for fabricating the same
US-12183623-B2 · Dec 31, 2024 · US
Staircase structure for memory device
US-12137558-B2 · Nov 5, 2024 · US
Semiconductor devices, fabrication methods thereof, 3d memories and memory devices
US-2024292625-A1 · Aug 29, 2024 · US
Semiconductor device and fabrication method thereof
US-2024203986-A1 · Jun 20, 2024 · US
Staircase structure for memory device
US-12010838-B2 · Jun 11, 2024 · US
Semiconductor devices and fabrication methods thereof, memory systems
US-2024164117-A1 · May 16, 2024 · US
“Living” radical polymerization method for vinyl monomer by near-infrared photothermal conversion
US-11958919-B2 · Apr 16, 2024 · US
Semiconductor device, manufacturing method thereof, and 3d nand memory
US-2023253511-A1 · Aug 10, 2023 · US
Semiconductor device and fabrication method thereof
US-2023126267-A1 · Apr 27, 2023 · US
3d memory device
US-2023092768-A1 · Mar 23, 2023 · US
Staircase structure for memory device
US-2023083030-A1 · Mar 16, 2023 · US
Staircase structure for memory device
US-2023084008-A1 · Mar 16, 2023 · US
Semiconductor device, three-dimensional memory and method for fabricating the semiconductor device
US-2023082694-A1 · Mar 16, 2023 · US
Semiconductor device and manufacturing method thereof, nand memory device
US-2023061535-A1 · Mar 2, 2023 · US
Semiconductor structure, fabrication method and three-dimensional memory
US-2023068185-A1 · Mar 2, 2023 · US
Semiconductor devices and methods for manufacturing the same, and nand memory devices
US-2023067170-A1 · Mar 2, 2023 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Yangtze Memory Tech Co Ltd | 55 |
| Univ Soochow | 2 |
| Huawei Tech Co Ltd | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10B43/27 | 40 |
| H10B43/35 | 30 |
| H10B43/20 | 26 |
| H10B43/40 | 24 |
| H01L27/11582 | 23 |