Semiconductor photonics devices and methods of formation
US-2025314917-A1 · Oct 9, 2025 · US
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Wu Chien-Ying patents
Wu Chien-Ying is listed as an inventor on 47 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Wu Chien-Ying |
| Total patents | 47 |
| First publication | Feb 19, 2015 |
| Latest publication | Oct 9, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Optical integrated circuit structure including edge coupling protective features and method of forming same
US-2025306309-A1 · Oct 2, 2025 · US
Optical integrated circuit structure including edge coupling protective features and method of forming same
US-12353034-B2 · Jul 8, 2025 · US
Optical coupling system
US-2025110283-A1 · Apr 3, 2025 · US
Photonic device and method of making
US-2025085476-A1 · Mar 13, 2025 · US
Photonic device on a semiconductor-on-insulator substrate and method of manufacturing thereof
US-12222542-B2 · Feb 11, 2025 · US
Method of using fiber to chip coupler and method of making
US-12169308-B2 · Dec 17, 2024 · US
Photonic Device on a Semiconductor-on-Insulator Substrate and Method of Manufacturing Thereof
US-2024393531-A1 · Nov 28, 2024 · US
Method of making photonic device
US-12153255-B2 · Nov 26, 2024 · US
Fiber to chip coupler and method of making the same
US-2024361532-A1 · Oct 31, 2024 · US
Recent patents
Latest publications not already listed above.
Fiber to chip coupler and method of using
US-12072534-B2 · Aug 27, 2024 · US
Fiber to chip coupler and method of making the same
US-12050348-B2 · Jul 30, 2024 · US
Optical integrated circuit structure including edge coupling protective features and method of forming same
US-2024201458-A1 · Jun 20, 2024 · US
Optical integrated circuit structure including edge coupling protective features and methods of forming same
US-11940659-B2 · Mar 26, 2024 · US
Photonic device and method of making same
US-11892678-B2 · Feb 6, 2024 · US
Fiber to chip coupler and method of making the same
US-11892681-B2 · Feb 6, 2024 · US
Capping structures for germanium-containing photovoltaic components and methods of forming the same
US-11848390-B2 · Dec 19, 2023 · US
Method of making photonic device
US-2023384527-A1 · Nov 30, 2023 · US
Method of using fiber to chip coupler and method of making
US-2023384528-A1 · Nov 30, 2023 · US
Fiber to chip coupler and method of making the same
US-2023384526-A1 · Nov 30, 2023 · US
Photonic device
US-2023358959-A1 · Nov 9, 2023 · US
Photonic device
US-11740409-B2 · Aug 29, 2023 · US
Optical integrated circuit structure including edge coupling protective features and methods of forming same
US-2023069212-A1 · Mar 2, 2023 · US
Fiber to chip coupler and method of making the same
US-2023061940-A1 · Mar 2, 2023 · US
Fiber to chip coupler and method of using
US-2023064550-A1 · Mar 2, 2023 · US
Photonic device and method of making same
US-2023068603-A1 · Mar 2, 2023 · US
Capping structures for germanium-containing photovoltaic components and methods of forming the same
US-11532759-B2 · Dec 20, 2022 · US
Infrared image sensor component manufacturing method
US-2022384503-A1 · Dec 1, 2022 · US
Photonic Device on a Semiconductor-on-Insulator Substrate and Method of Manufacturing Thereof
US-2022342149-A1 · Oct 27, 2022 · US
Capping structures for germanium-containing photovoltaic components and methods of forming the same
US-2022336684-A1 · Oct 20, 2022 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Taiwan Semiconductor Mfg Co Ltd | 46 |
| Taiwan Semiconductor Mfg | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| G02B6/30 | 30 |
| G02B6/34 | 22 |
| G02B6/136 | 21 |
| G02B6/12004 | 14 |
| G02B6/12 | 12 |