Top side cooling for power amplifier module
US-2025022765-A1 · Jan 16, 2025 · US
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Woods Mark C patents
Woods Mark C is listed as an inventor on 8 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Woods Mark C |
| Total patents | 8 |
| First publication | Oct 5, 2017 |
| Latest publication | Jan 16, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Multichip module thermal management through backside metal
US-2023343721-A1 · Oct 26, 2023 · US
Substrate with embedded active thermoelectric cooler
US-11551995-B2 · Jan 10, 2023 · US
Electronics package with improved thermal performance
US-10840165-B2 · Nov 17, 2020 · US
Electronics package with improved thermal performance
US-2019252287-A1 · Aug 15, 2019 · US
Electronics package with improved thermal performance
US-10325828-B2 · Jun 18, 2019 · US
Substrate with embedded active thermoelectric cooler
US-2019131209-A1 · May 2, 2019 · US
Electronics package with improved thermal performance
US-2017287807-A1 · Oct 5, 2017 · US
Recent patents
Latest publications not already listed above.
No data yet.
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Qorvo Us Inc | 8 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W70/635 | 7 |
| H10W70/68 | 6 |
| H01L23/13 | 6 |
| H10W74/15 | 5 |
| H10W90/00 | 5 |