Electronic package module and method for fabrication of the same
US-2024413067-A1 · Dec 12, 2024 · US
Electricity
Electricity · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H01L23/13 |
| Official title | — |
| Display label | Electricity (mapped technology topic) |
| Total patents | 2,502 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 115 |
| 2016 | 174 |
| 2017 | 204 |
| 2018 | 232 |
| 2019 | 289 |
| 2020 | 310 |
| 2021 | 234 |
| 2022 | 217 |
| 2023 | 184 |
| 2024 | 228 |
| 2025 | 259 |
| 2026 | 56 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Method for fabricating a semiconductor device including an embedded semiconductor die
US-2024250004-A1 · Jul 25, 2024 · US
Symmetric dummy bridge design for fli alignment improvement
US-2024186251-A1 · Jun 6, 2024 · US
Semiconductor device and mounting structure for semiconductor element
US-2024170353-A1 · May 23, 2024 · US
Double-sided substrate with cavities for direct die-to-die interconnect
US-2024038729-A1 · Feb 1, 2024 · US
Bio-implantable hermetic integrated ultra high density device
US-9224664-B2 · Dec 29, 2015 · US
Stub minimization using duplicate sets of signal terminals
US-9224431-B2 · Dec 29, 2015 · US
Multilayer ceramic electronic device and method for manufacturing the same
US-9226400-B2 · Dec 29, 2015 · US
Wiring substrate and method of manufacturing the same
US-9210808-B2 · Dec 8, 2015 · US
Multilayer substrate
US-9204545-B2 · Dec 1, 2015 · US
Methods of fabricating fan-out wafer level packages and packages formed by the methods
US-9202716-B2 · Dec 1, 2015 · US
Semiconductor device having a die and through substrate-via
US-9196587-B2 · Nov 24, 2015 · US
Electronic component, arrangement and method
US-9196554-B2 · Nov 24, 2015 · US
Semiconductor package
US-9184127-B2 · Nov 10, 2015 · US
Method for assembling a chip in a flexible substrate
US-9179586-B2 · Nov 3, 2015 · US
Semiconductor package having embedded semiconductor elements
US-9177859-B2 · Nov 3, 2015 · US
Interconnect structures and methods of making the same
US-9173282-B2 · Oct 27, 2015 · US
High performance package on package
US-9165906-B2 · Oct 20, 2015 · US
Flip-chip hybridization of microelectronic components using suspended fusible resistive connection elements
US-9165915-B2 · Oct 20, 2015 · US
Window ball grid array (BGA) semiconductor packages
US-9159691-B2 · Oct 13, 2015 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H01L23/13?
- CPC H01L23/13 is the Cooperative Patent Classification code for “Electricity.”
- How many patents are filed under CPC H01L23/13 (Electricity)?
- Our database includes 2,502 publications tagged with this CPC code.
- Is patent activity under CPC H01L23/13 growing?
- Publication counts under this code: 228 in 2024 vs 259 in 2025 (latest complete years).