Wire bonding apparatus, wire bonding method and semiconductor device
US-12451459-B2 · Oct 21, 2025 · US
Wang Xuhui is listed as an inventor on 13 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Wang Xuhui |
| Total patents | 13 |
| First publication | Jun 14, 2018 |
| Latest publication | Oct 21, 2025 |
Publications ranked by popularity score, then publication date.
US-12451459-B2 · Oct 21, 2025 · US
US-12287304-B2 · Apr 29, 2025 · US
US-2024404901-A1 · Dec 5, 2024 · US
US-2024395765-A1 · Nov 28, 2024 · US
US-2024369509-A1 · Nov 7, 2024 · US
US-2024363588-A1 · Oct 31, 2024 · US
US-11405545-B2 · Aug 2, 2022 · US
US-2021286038-A1 · Sep 16, 2021 · US
US-2020177799-A1 · Jun 4, 2020 · US
US-10539650-B2 · Jan 21, 2020 · US
Latest publications not already listed above.
US-10235871-B2 · Mar 19, 2019 · US
US-2018267136-A1 · Sep 20, 2018 · US
US-2018165947-A1 · Jun 14, 2018 · US
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Ninebot Beijing Tech Co Ltd | 5 |
| Yangtze Memory Tech Co Ltd | 4 |
| Jrd Communication Shenzhen Ltd | 2 |
| Univ Jiangnan | 2 |
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H01L24/48 | 4 |
| H10W72/50 | 3 |
| H10W72/07521 | 2 |
| H10W72/07511 | 2 |
| H10W72/07173 | 2 |