Wire bonding apparatus, wire bonding method and semiconductor device

Patent metadata

Field	Value
Publication number	US-12451459-B2
Application number	US-202318456297-A
Country	US
Kind code	B2
Filing date	Aug 25, 2023
Priority date	May 26, 2023
Publication date	Oct 21, 2025
Grant date	Oct 21, 2025

Abstract

The present disclosure provides a wire bonding apparatus, a wire bonding method and a semiconductor device. The wire bonding apparatus includes: a wire tube for containing the wire and including a wire exit; a wire heating assembly located at a side of the wire exit; and a pre-shaping assembly located at a side of the wire tube and including a wire pre-pressing face; the pre-shaping assembly having a first state in which the wire pre-pressing face of the pre-shaping assembly is configured to abut the wire tube and a second state in which the pre-shaping assembly is configured to disengage from the wire tube. The wire bonding apparatus, the wire bonding method and the semiconductor device as provided in the present disclosure can reduce or eliminate the cratering effect.

First claim

What is claimed is:

1. A wire bonding apparatus, comprising:
a wire tube configured to contain a wire and comprising a wire exit;
a wire heating assembly located at a side of the wire exit; and
a pre-shaping assembly located at a side of the wire tube and comprising a wire pre-pressing face; and
wherein the pre-shaping assembly has a first state and a second state, the wire pre-pressing face of the pre-shaping assembly in the first state configured to abut the wire tube, and the pre-shaping assembly in the second state configured to disengage from the wire tube,
wherein the wire pre-pressing face is a camber surface, a circle to which the camber surface of the wire pre-pressing face belongs has a radius greater than a radius of a circle to which a camber surface of a solder ball formed by heating the wire protruding out of the wire tube belongs.

2. The wire bonding apparatus of claim 1 , further comprising:
a carrier platform comprising a carrier face on which a bonding element is located;
wherein an orthogonal projection of the wire tube on the carrier face lies on the carrier face;
the pre-shaping assembly in the first state is located between the carrier face and the wire tube; and
an overlap degree between an orthogonal projection of the pre-shaping assembly in the second state on the carrier face and an orthogonal projection of the wire tube on the carrier face is 0.

3. The wire bonding apparatus of claim 2 , wherein the wire tube extends in a first direction, and the wire bonding apparatus further comprises a first driver connected with the wire tube;
wherein the first driver is configured to drive the wire tube to reciprocate in the first direction.

4. The wire bonding apparatus of claim 3 , further comprising a second driver connected with the pre-shaping assembly;
wherein the second driver is configured to drive the pre-shaping assembly to switch between the first state and the second state.

5. The wire bonding apparatus of claim 4 , wherein the second driver is configured to drive the pre-shaping assembly to move in a second direction intersecting the first direction.

6. The wire bonding apparatus of claim 3 , further comprising:
a holder comprising a guiding groove extending in the first direction;
wherein the wire tube passes through the guiding groove and is fixed in the guiding groove.

7. The wire bonding apparatus of claim 2 , wherein the camber surface of the solder ball faces the carrier face.

8. The wire bonding apparatus of claim 2 , further comprising a wire pulling assembly;
wherein the wire tube is located between the wire pulling assembly and the carrier platform.

9. The wire bonding apparatus of claim 8 , further comprising a wire tensioning assembly;
wherein the wire pulling assembly is located between the wire tensioning assembly and the wire tube.

10. The wire bonding apparatus of claim 2 , wherein the pre-shaping assembly in the first state is located on the carrier face.

11. The wire bonding apparatus of claim 1 , wherein at least a part of the wire pre-pressing face is a plane.

12. A wire bonding method, comprising:
starting a wire heating assembly to convert a wire protruding from a wire exit of a wire tube into an initial solder ball;
driving a pre-shaping assembly to move relative to the wire exit such that a wire pre-pressing face of the pre-shaping assembly contacts the initial solder ball;
driving the wire tube to move in a first direction relative to the pre-shaping assembly so as to generate a pre-pressure between the initial solder ball and the wire pre-pressing face of the pre-shaping assembly to convert the initial solder ball into a solder ball, wherein a height of the initial solder ball in the first direction is greater than a height of the solder ball in the first direction;
driving the pre-shaping assembly to move away from the wire tube; and
placing a first bonding element on a bonding site, driving the wire tube to move in the first direction relative to the first bonding element, and bonding the solder ball on the first bonding element,
wherein the wire pre-pressing face is a camber surface, a circle to which the camber surface of the wire pre-pressing face belongs has a radius greater than a radius of a circle to which a camber surface of a solder ball formed by heating the wire protruding out of the wire tube belongs.

13. The wire bonding method of claim 12 , wherein the first bonding element comprises a circuit layer and a pad, and the pad is located on and connected with the circuit layer; and
bonding the solder ball on the first bonding element comprises:
bonding the solder ball on the pad.

14. The wire bonding method of claim 12 , further comprising: after bonding the solder ball on the first bonding element,
driving the wire tube to disengage from the solder ball;
moving the first bonding element to be away from the bonding site, and pulling wire out of the wire tube during a process of moving the first bonding element; and
placing a second bonding element on the bonding site, driving the wire tube to move towards the second bonding element, and bonding the wire on the second bonding element.

15. The wire bonding method of claim 12 , further comprising: before driving the pre-shaping assembly to move away from the wire tube,
driving the wire tube to disengage from the pre-shaping assembly.

16. The wire bonding method of claim 12 , wherein:
a carrier platform comprises a carrier face on which a bonding element is located;
wherein an orthogonal projection of the wire tube on the carrier face lies on the carrier face;
the pre-shaping assembly in a first state is located between the carrier face and the wire tube; and
an overlap degree between an orthogonal projection of the pre-shaping assembly in a second state on the carrier face and an orthogonal projection of the wire tube on the carrier face is 0.

17. The wire bonding method of claim 16 , further comprising driving the pre-shaping assembly to switch between the first state and the second state.

18. The wire bonding method of claim 12 , further comprising driving the wire tube to reciprocate in the first direction.

19. The wire bonding method of claim 12 , further comprising driving the pre-shaping assembly to move in a second direction intersecting the first direction.

20. The wire bonding method of claim 16 , wherein the camber surface of the solder ball faces the carrier face.

Assignees

• Yangtze Memory Tech Co Ltd

Inventors

• Wang Xuhui

Classifications

• H10W72/07521

  Aligning · CPC title

• H10W72/07511

  Treating the bonding area before connecting, e.g. by applying flux or cleaning · CPC title

• H10W72/07173

  Means for moving chips, wafers or other parts, e.g. conveyor belts · CPC title

• H10W72/07163

  Means for mechanical processing, e.g. for planarising, pressing, stamping or drilling · CPC title

• H10W72/07141

  Means for applying energy, e.g. ovens or lasers · CPC title