Method and apparatus for reducing particle defects in plasma etch chambers
US-11488812-B2 · Nov 1, 2022 · US
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Wang Xikun patents
Wang Xikun is listed as an inventor on 71 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Wang Xikun |
| Total patents | 71 |
| First publication | Feb 10, 2015 |
| Latest publication | Nov 1, 2022 |
Notable patents
Publications ranked by popularity score, then publication date.
Gate contact over active regions
US-11462411-B2 · Oct 4, 2022 · US
Gate contact over active regions
US-2021249270-A1 · Aug 12, 2021 · US
High temperature RF heater pedestals
US-11062887-B2 · Jul 13, 2021 · US
Methods and apparatus for hybrid feature metallization
US-11024537-B2 · Jun 1, 2021 · US
Gate contact over active processes
US-11004687-B2 · May 11, 2021 · US
Methods and apparatus for filling a feature disposed in a substrate
US-10950500-B2 · Mar 16, 2021 · US
Methods and apparatus for hybrid feature metallization
US-2021043506-A1 · Feb 11, 2021 · US
Selective cobalt removal for bottom up gapfill
US-10770346-B2 · Sep 8, 2020 · US
Gate contact over active processes
US-2020258744-A1 · Aug 13, 2020 · US
Recent patents
Latest publications not already listed above.
Methods and apparatus for filling a feature disposed in a substrate
US-2020251340-A1 · Aug 6, 2020 · US
Tantalum-containing material removal
US-10727080-B2 · Jul 28, 2020 · US
Method and apparatus for reducing particle defects in plasma etch chambers
US-10658161-B2 · May 19, 2020 · US
High temperature rf heater pedestals
US-2020090912-A1 · Mar 19, 2020 · US
Oxide and metal removal
US-10465294-B2 · Nov 5, 2019 · US
Method and apparatus for reducing particle defects in plasma etch chambers
US-2019295826-A1 · Sep 26, 2019 · US
Selective cobalt removal for bottom up gapfill
US-2019122923-A1 · Apr 25, 2019 · US
Selective tungsten removal
US-10256112-B1 · Apr 9, 2019 · US
Methods of etching films with reduced surface roughness
US-10233547-B2 · Mar 19, 2019 · US
Tantalum-containing material removal
US-2019013211-A1 · Jan 10, 2019 · US
Selective cobalt removal for bottom up gapfill
US-10163696-B2 · Dec 25, 2018 · US
Methods and apparatus for filling a feature disposed in a substrate
US-2018323103-A1 · Nov 8, 2018 · US
Selective in situ cobalt residue removal
US-10049891-B1 · Aug 14, 2018 · US
Methods of Etching Films with Reduced Surface Roughness
US-2018195179-A1 · Jul 12, 2018 · US
Selective cobalt removal for bottom up gapfill
US-2018138085-A1 · May 17, 2018 · US
Cobalt-containing material removal
US-9947549-B1 · Apr 17, 2018 · US
Cobalt-containing material removal
US-2018102259-A1 · Apr 12, 2018 · US
Methods of etching films with reduced surface roughness
US-9896770-B2 · Feb 20, 2018 · US
Selective etch for metal-containing materials
US-9711366-B2 · Jul 18, 2017 · US
Metal removal with reduced surface roughness
US-9659791-B2 · May 23, 2017 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Applied Materials Inc | 71 |
| Applied Mateials Inc | 1 |
| Wang Xikun | 1 |
| Nguyen Andrew | 1 |
| Lee Changhun | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10P50/267 | 42 |
| H01J37/32357 | 31 |
| H01L21/32136 | 29 |
| H10P50/266 | 27 |
| H01J2237/334 | 24 |