Wearable system and blood pressure measurement method which can be performed by the wearable system
US-2026096733-A1 · Apr 9, 2026 · US
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Wang Hung-Chih patents
Wang Hung-Chih is listed as an inventor on 50 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Wang Hung-Chih |
| Total patents | 50 |
| First publication | Apr 14, 2015 |
| Latest publication | Apr 9, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Wearable device with blood oxygen measurement function and blood oxygen measurement method
US-2026090740-A1 · Apr 2, 2026 · US
Ring-type electrodermal activity measurement device
US-2026090731-A1 · Apr 2, 2026 · US
Connect structure for semiconductor processing equipment
US-12562347-B2 · Feb 24, 2026 · US
Semiconductor processing station and semiconductor process using the same
US-12557584-B2 · Feb 17, 2026 · US
Semiconductor device structure and methods of forming the same
US-2025357319-A1 · Nov 20, 2025 · US
Power device
US-2025337269-A1 · Oct 30, 2025 · US
Power device
US-2025336282-A1 · Oct 30, 2025 · US
Substrate carrying unit and substrate processing device having the same
US-2025323083-A1 · Oct 16, 2025 · US
Wafer shift detection
US-2025323072-A1 · Oct 16, 2025 · US
Recent patents
Latest publications not already listed above.
Wafer shift detection
US-12394647-B2 · Aug 19, 2025 · US
System and method for cleaning a pre-clean process chamber
US-12241157-B2 · Mar 4, 2025 · US
System and method for cleaning a pre-clean process chamber
US-2024384402-A1 · Nov 21, 2024 · US
Clamp ring and method of using clamp ring
US-2024387233-A1 · Nov 21, 2024 · US
Clamp ring and method of using clamp ring
US-12142514-B2 · Nov 12, 2024 · US
Connect structure for semiconductor processing equipment
US-2024355591-A1 · Oct 24, 2024 · US
Wafer pod transfer assembly
US-2024321616-A1 · Sep 26, 2024 · US
Power alarm and fire loading risk reduction for a deposition tool
US-2024297085-A1 · Sep 5, 2024 · US
Connect structure for semiconductor processing equipment
US-12040163-B2 · Jul 16, 2024 · US
Power alarm and fire loading risk reduction for a deposition tool
US-12020994-B2 · Jun 25, 2024 · US
Wafer pod transfer assembly
US-12002699-B2 · Jun 4, 2024 · US
Wafer shift detection
US-2024105480-A1 · Mar 28, 2024 · US
Semiconductor wafer processing tool with improved leak check
US-2024084445-A1 · Mar 14, 2024 · US
Connect structure for semiconductor processing equipment
US-2024021416-A1 · Jan 18, 2024 · US
Transfer blade for robot
US-2023373100-A1 · Nov 23, 2023 · US
Wafer pod transfer assembly
US-2023207365-A1 · Jun 29, 2023 · US
Wafer pod transfer assembly
US-11600506-B2 · Mar 7, 2023 · US
Semiconductor apparatus for deposition process
US-2023065818-A1 · Mar 2, 2023 · US
Clamp ring and method of using clamp ring
US-2023068139-A1 · Mar 2, 2023 · US
System and method for cleaning a pre-clean process chamber
US-2023017955-A1 · Jan 19, 2023 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Taiwan Semiconductor Mfg Co Ltd | 43 |
| Pixart Imaging Inc | 3 |
| Lite On Electronics Guangzhou | 3 |
| Lite On Technology Corp | 3 |
| Cyber Power Systems Inc | 2 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10P72/12 | 13 |
| H10P72/0431 | 10 |
| H10P72/0466 | 8 |
| H10P72/0434 | 8 |
| H10P72/0464 | 8 |