Wafer pod transfer assembly

US2023207365A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2023207365-A1
Application numberUS-202318117593-A
CountryUS
Kind codeA1
Filing dateMar 6, 2023
Priority dateApr 23, 2021
Publication dateJun 29, 2023
Grant date

How to read this patent

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

A wafer pod transfer assembly includes a wafer pod port to receive a wafer pod, a transfer axle coupled to the wafer pod port, a shaft receiver, a shaft coupled to the transfer axle and to the shaft receiver, a pin through the shaft receiver and through the shaft, wherein the pin comprises a first end and a second end, opposite the first end, and a pin buckle including a first loop and a second loop. The pin buckle is coupled to the pin, the first loop encircles the first end of the pin, and the second loop encircles the second end of the pin.

First claim

Opening claim text (preview).

What is claimed is: 1 . A wafer pod transfer assembly, comprising: a wafer pod port to receive a wafer pod; a transfer axle coupled to the wafer pod port; a shaft receiver; a shaft coupled to the transfer axle and to the shaft receiver; a pin through the shaft receiver and through the shaft, wherein the pin comprises a first end and a second end opposite the first end; a pin screw through the shaft receiver and through the shaft, wherein the pin screw abuts a side surface of the pin; and a pin buckle comprising a first loop and a second loop, wherein: the pin buckle is coupled to the pin, the first loop encircles the first end of the pin, and the second loop encircles the second end of the pin. 2 . The wafer pod transfer assembly of claim 1 , wherein the pin buckle is a C-type pin buckle. 3 . The wafer pod transfer assembly of claim 1 , wherein the shaft is within the shaft receiver. 4 . The wafer pod transfer assembly of claim 1 , comprising: a gear coupled to the shaft receiver. 5 . The wafer pod transfer assembly of claim 4 , wherein the gear comprises the shaft receiver. 6 . The wafer pod transfer assembly of claim 1 , wherein the wafer pod port comprises wafer pod carrying arms configured to rotate to engage with the wafer pod. 7 . The wafer pod transfer assembly of claim 1 , wherein a diameter of the pin buckle is less than a length of the pin. 8 . A wafer pod transfer assembly, comprising: a wafer pod port to receive a wafer pod; a shaft receiver; a shaft coupled to the shaft receiver, wherein the wafer pod port is coupled to the shaft receiver through the shaft; a pin through the shaft receiver and through the shaft; and a pin screw through the shaft receiver and through the shaft, wherein the pin screw abuts a side surface of the pin. 9 . The wafer pod transfer assembly of claim 8 , comprising: a pin buckle, wherein the pin screw is between a first end of the pin buckle and a second end of the pin buckle. 10 . The wafer pod transfer assembly of claim 8 , comprising: a gear coupled to the shaft receiver, wherein the pin screw extends through the gear. 11 . The wafer pod transfer assembly of claim 8 , wherein an interior surface of the shaft receiver defines a cavity configured to receive a portion of the shaft. 12 . The wafer pod transfer assembly of claim 8 , comprising: a belt, wherein the wafer pod port is coupled to the shaft through the belt. 13 . The wafer pod transfer assembly of claim 8 , comprising: a transfer axle coupled to the wafer pod port; and a belt coupled to the transfer axle and to the shaft. 14 . The wafer pod transfer assembly of claim 13 , comprising: a drive assembly, wherein the transfer axle is coupled to the belt through the drive assembly. 15 . A wafer pod transfer assembly, comprising: a wafer pod port to receive a wafer pod; a transfer axle coupled to the wafer pod port; a belt coupled to the transfer axle; and a shaft coupled to the belt, wherein rotation of the shaft causes rotation of the transfer axle through the belt. 16 . The wafer pod transfer assembly of claim 15 , comprising: a pin through the shaft. 17 . The wafer pod transfer assembly of claim 16 , comprising: a shaft receiver coupled to the shaft, wherein the pin extends through the shaft receiver. 18 . The wafer pod transfer assembly of claim 17 , comprising: a pin screw through the shaft receiver and through the shaft, wherein the pin screw abuts a side surface of the pin. 19 . The wafer pod transfer assembly of claim 16 , comprising: a shaft receiver coupled to the shaft; and a pin buckle coupled to the pin and extending around the shaft receiver. 20 . The wafer pod transfer assembly of claim 19 , comprising: a gear coupled to the shaft receiver.

Assignees

Inventors

Classifications

  • Mechanical parts of transfer devices · CPC title

  • Conveying cassettes, containers or carriers · CPC title

  • Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls · CPC title

  • Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements · CPC title

  • Trays for chips · CPC title

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Frequently asked questions

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What does patent US2023207365A1 cover?
A wafer pod transfer assembly includes a wafer pod port to receive a wafer pod, a transfer axle coupled to the wafer pod port, a shaft receiver, a shaft coupled to the transfer axle and to the shaft receiver, a pin through the shaft receiver and through the shaft, wherein the pin comprises a first end and a second end, opposite the first end, and a pin buckle including a first loop and a second…
Who is the assignee on this patent?
Taiwan Semiconductor Mfg Co Ltd
What technology area does this patent fall under?
Primary CPC classification H10P72/3402. Mapped technology areas include Electricity.
When was this patent published?
Publication date Thu Jun 29 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).