Wafer backside cleaning method
US-12518961-B2 · Jan 6, 2026 · US
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Wang Deyun patents
Wang Deyun is listed as an inventor on 11 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Wang Deyun |
| Total patents | 11 |
| First publication | Aug 12, 2021 |
| Latest publication | Jan 6, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Apparatus and method for cleaning semiconductor wafers
US-12494360-B2 · Dec 9, 2025 · US
Method and apparatus for removing particles or photoresist on substrates
US-2025285882-A1 · Sep 11, 2025 · US
Method and apparatus for removing particles or photoresist on substrates
US-12334367-B2 · Jun 17, 2025 · US
Coating and developing device
US-2025130511-A1 · Apr 24, 2025 · US
Wafer backside cleaning method
US-2025046598-A1 · Feb 6, 2025 · US
Drying apparatus and method based on supercritical fluid
US-2024363370-A1 · Oct 31, 2024 · US
Apparatus and method for cleaning semiconductor wafers
US-2024355614-A1 · Oct 24, 2024 · US
Apparatus and method for cleaning semiconductor wafers
US-12068149-B2 · Aug 20, 2024 · US
Method and apparatus for removing particles or photoresist on substrates
US-2023143401-A1 · May 11, 2023 · US
Recent patents
Latest publications not already listed above.
Apparatus and method for cleaning semiconductor wafers
US-2021249257-A1 · Aug 12, 2021 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Acm Research Shanghai Inc | 11 |
| Acm Res Korea Co Ltd | 1 |
| Cleanchip Tech Limited | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10P72/0406 | 10 |
| H10P72/3302 | 8 |
| H10P72/0456 | 8 |
| H10P72/0414 | 6 |
| H10P72/0448 | 5 |