Scandump simulation and co-simulation for device testing
US-2026092965-A1 · Apr 2, 2026 · US
Wang Chunlin is listed as an inventor on 14 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Wang Chunlin |
| Total patents | 14 |
| First publication | Aug 13, 2015 |
| Latest publication | Apr 2, 2026 |
Publications ranked by popularity score, then publication date.
US-2026092965-A1 · Apr 2, 2026 · US
US-2026072737-A1 · Mar 12, 2026 · US
US-10289574-B2 · May 14, 2019 · US
US-2019002979-A1 · Jan 3, 2019 · US
US-10163180-B2 · Dec 25, 2018 · US
US-9959665-B2 · May 1, 2018 · US
US-9920370-B2 · Mar 20, 2018 · US
US-9562269-B2 · Feb 7, 2017 · US
US-2017024926-A1 · Jan 26, 2017 · US
US-2016321774-A1 · Nov 3, 2016 · US
Latest publications not already listed above.
US-2016004651-A1 · Jan 7, 2016 · US
US-2015379195-A1 · Dec 31, 2015 · US
US-9135179-B2 · Sep 15, 2015 · US
US-2015225789-A1 · Aug 13, 2015 · US
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Qualcomm Inc | 8 |
| Univ Leland Stanford Junior | 5 |
| Samsung Electronics Co Ltd | 2 |
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| C12Q2600/156 | 5 |
| C12Q1/6881 | 5 |
| G06F19/22 | 5 |
| G16B30/10 | 5 |
| G16B30/00 | 5 |