Image sensor packaging and methods for forming the same
US-2025351611-A1 · Nov 13, 2025 · US
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Wang Cheng-Jong patents
Wang Cheng-Jong is listed as an inventor on 5 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Wang Cheng-Jong |
| Total patents | 5 |
| First publication | May 26, 2015 |
| Latest publication | Nov 13, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Image sensor packaging and methods for forming the same
US-2024096918-A1 · Mar 21, 2024 · US
Semiconductor arrangement having capacitor separated from active region
US-9837421-B2 · Dec 5, 2017 · US
Semiconductor arrangement having capacitor separated from active region
US-2017025417-A1 · Jan 26, 2017 · US
Interconnect structure and method
US-9041206-B2 · May 26, 2015 · US
Recent patents
Latest publications not already listed above.
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Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Taiwan Semiconductor Mfg Co Ltd | 4 |
| Taiwan Semiconductor Mfg | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10F39/811 | 3 |
| H10F39/026 | 3 |
| H10F39/014 | 3 |
| H10F39/182 | 3 |
| H10P50/283 | 2 |