System and method for reducing mutual coupling for noise reduction in semiconductor device packaging
US-11488904-B2 · Nov 1, 2022 · US
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Varshney Sumit patents
Varshney Sumit is listed as an inventor on 7 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Varshney Sumit |
| Total patents | 7 |
| First publication | Jan 21, 2016 |
| Latest publication | Nov 1, 2022 |
Notable patents
Publications ranked by popularity score, then publication date.
System and method for reducing mutual coupling for noise reduction in semiconductor device packaging
US-2022208672-A1 · Jun 30, 2022 · US
Integrated circuit with on-die decoupling capacitors
US-9418873-B2 · Aug 16, 2016 · US
Signal bond wire shield
US-9337140-B1 · May 10, 2016 · US
Integrated circuit with on-die decoupling capacitors
US-2016056099-A1 · Feb 25, 2016 · US
Semiconductor device with active shielding of leads
US-9271390-B2 · Feb 23, 2016 · US
Semiconductor device with active shielding of leads
US-2016021734-A1 · Jan 21, 2016 · US
Recent patents
Latest publications not already listed above.
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Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Freescale Semiconductor Inc | 5 |
| Varshney Sumit | 4 |
| Nxp Bv | 2 |
| Srivastava Sunaina | 2 |
| Imam Raza | 2 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/756 | 7 |
| H10W42/20 | 5 |
| H10W72/07554 | 5 |
| H10W70/465 | 5 |
| H10W72/932 | 5 |