Electrode device for living body
US-2025057457-A1 · Feb 20, 2025 · US
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Ueda Ryuji patents
Ueda Ryuji is listed as an inventor on 10 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Ueda Ryuji |
| Total patents | 10 |
| First publication | Jan 22, 2015 |
| Latest publication | Feb 20, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Metal foil pattern layered body, metal foil layered body, metal foil multi-layer substrate, solar cell module, and method of manufacturing metal foil pattern layered body
US-10672928-B2 · Jun 2, 2020 · US
Method of manufacturing a circuit board by punching
US-10651320-B2 · May 12, 2020 · US
Method of manufacturing a circuit board by punching
US-2019288127-A1 · Sep 19, 2019 · US
Metal foil pattern layered body, metal foil layered body, metal foil multi-layer substrate, solar cell module, and method of manufacturing metal foil pattern layered body
US-10056517-B2 · Aug 21, 2018 · US
Metal foil pattern layered body, metal foil layered body, metal foil multi-layer substrate, solar cell module, and method of manufacturing metal foil pattern layered body
US-2017358700-A1 · Dec 14, 2017 · US
Method of manufacturing a circuit board by punching
US-2017018660-A1 · Jan 19, 2017 · US
Method of manufacturing a circuit board by punching
US-9478674-B2 · Oct 25, 2016 · US
Light-emitting element driving device
US-9237627-B2 · Jan 12, 2016 · US
Light-emitting element driving device
US-2015022089-A1 · Jan 22, 2015 · US
Recent patents
Latest publications not already listed above.
No data yet.
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Dsm Ip Assets Bv | 7 |
| Panasonic Corp | 2 |
| Toppan Holdings Inc | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H01L31/0516 | 7 |
| Y02E10/50 | 7 |
| H05K2201/10143 | 7 |
| H05K3/20 | 7 |
| H10F19/908 | 7 |