Method for producing microelectromechanical structures
US-2026015225-A1 · Jan 15, 2026 · US
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Tomaschko Jochen patents
Tomaschko Jochen is listed as an inventor on 22 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Tomaschko Jochen |
| Total patents | 22 |
| First publication | Aug 20, 2015 |
| Latest publication | Jan 15, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Micromechanical device
US-12481150-B2 · Nov 25, 2025 · US
Bond structures on MEMS element and ASIC element
US-12448280-B2 · Oct 21, 2025 · US
Semiconductor component including a dielectric layer
US-12414470-B2 · Sep 9, 2025 · US
Semiconductor component including a dielectric layer
US-12396366-B2 · Aug 19, 2025 · US
Method for producing a wafer connection
US-12030773-B2 · Jul 9, 2024 · US
Microelectronics device and method for producing a microelectronics device
US-11870369-B2 · Jan 9, 2024 · US
Micromechanical device
US-2023152572-A1 · May 18, 2023 · US
Method for producing a microelectronic device
US-2023065179-A1 · Mar 2, 2023 · US
Semiconductor component including a dielectric layer
US-2022238791-A1 · Jul 28, 2022 · US
Recent patents
Latest publications not already listed above.
Semiconductor component including a dielectric layer
US-2022231219-A1 · Jul 21, 2022 · US
Microelectronics device and method for producing a microelectronics device
US-2021328524-A1 · Oct 21, 2021 · US
Method for producing a wafer connection
US-2021292160-A1 · Sep 23, 2021 · US
Bond structures on mems element and asic element
US-2020399116-A1 · Dec 24, 2020 · US
Method for forming a cavity and a component having a cavity
US-10840107-B2 · Nov 17, 2020 · US
Method for forming a cavity and a component having a cavity
US-2019348300-A1 · Nov 14, 2019 · US
Method for forming a cavity and a component having a cavity
US-10431474-B2 · Oct 1, 2019 · US
Method for producing a wafer equipped with transparent plates
US-9663351-B2 · May 30, 2017 · US
Method for forming a cavity and a component having a cavity
US-2017140943-A1 · May 18, 2017 · US
Manufacturing method for a piezoelectric layer arrangement and corresponding piezoelectric layer arrangement
US-9461234-B2 · Oct 4, 2016 · US
Manufacturing method for a piezoelectric layer arrangement and corresponding piezoelectric layer arrangement
US-2016035959-A1 · Feb 4, 2016 · US
Method for producing a wafer equipped with transparent plates
US-2015232328-A1 · Aug 20, 2015 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Bosch Gmbh Robert | 22 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10N30/87 | 8 |
| H10N30/8554 | 8 |
| H10N30/704 | 6 |
| G02B26/0833 | 6 |
| B81B2203/033 | 5 |