Seed layer, a heterostructure comprising the seed layer and a method of forming a layer of material using the seed layer
US-12431350-B2 · Sep 30, 2025 · US
Toh Chee Tat is listed as an inventor on 20 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Toh Chee Tat |
| Total patents | 20 |
| First publication | Mar 19, 2015 |
| Latest publication | Sep 30, 2025 |
Publications ranked by popularity score, then publication date.
US-12431350-B2 · Sep 30, 2025 · US
US-12264070-B2 · Apr 1, 2025 · US
US-2024164948-A1 · May 23, 2024 · US
US-11848037-B2 · Dec 19, 2023 · US
US-2023154747-A1 · May 18, 2023 · US
US-2022367870-A1 · Nov 17, 2022 · US
US-2022246547-A1 · Aug 4, 2022 · US
US-11192788-B2 · Dec 7, 2021 · US
US-11114674-B2 · Sep 7, 2021 · US
US-2021017026-A1 · Jan 21, 2021 · US
Latest publications not already listed above.
US-10815584-B2 · Oct 27, 2020 · US
US-10683586-B2 · Jun 16, 2020 · US
US-10663833-B2 · May 26, 2020 · US
US-2018337411-A1 · Nov 22, 2018 · US
US-2018244524-A1 · Aug 30, 2018 · US
US-2017032815-A1 · Feb 2, 2017 · US
US-2016340797-A1 · Nov 24, 2016 · US
US-2016258081-A1 · Sep 8, 2016 · US
US-2016259224-A1 · Sep 8, 2016 · US
US-2015075602-A1 · Mar 19, 2015 · US
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Nat Univ Singapore | 19 |
| Univ Singapore | 1 |
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| C01P2006/40 | 8 |
| C01P2002/02 | 8 |
| C01B32/05 | 8 |
| C23C16/483 | 8 |
| C23C16/26 | 7 |