System and method for reduced workpiece adhesion due to electrostatic charge during removal from a processing station
US-10825645-B2 · Nov 3, 2020 · US
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Suuronen David E patents
Suuronen David E is listed as an inventor on 11 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Suuronen David E |
| Total patents | 11 |
| First publication | Oct 1, 2015 |
| Latest publication | Nov 3, 2020 |
Notable patents
Publications ranked by popularity score, then publication date.
Platen for reducing particle contamination on a substrate and a method thereof
US-10658207-B2 · May 19, 2020 · US
System And Method For Reduced Workpiece Adhesion Due To Electrostatic Charge During Removal From A Processing Station
US-2019057835-A1 · Feb 21, 2019 · US
System and method for in situ temperature measurement
US-10113917-B2 · Oct 30, 2018 · US
Platen For Reducing Particle Contamination On A Substrate and a Method Thereof
US-2018233386-A1 · Aug 16, 2018 · US
Platen for reducing particle contamination on a substrate and a method thereof
US-9953849-B2 · Apr 24, 2018 · US
Method for implantation of semiconductor wafers having high bulk resistivity
US-9824857-B2 · Nov 21, 2017 · US
Method for implantation of semiconductor wafers having high bulk resistivity
US-2017207063-A1 · Jul 20, 2017 · US
System And Method For In Situ Temperature Measurement
US-2017131154-A1 · May 11, 2017 · US
System and method for analyzing voltage breakdown in electrostatic chucks
US-9417280-B2 · Aug 16, 2016 · US
Recent patents
Latest publications not already listed above.
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Varian Semiconductor Equipment Ass Inc | 10 |
| Varian Semiconductor Equipment | 1 |
| Varian Semiconductor Ass Inc | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10P72/7614 | 4 |
| H10P72/0434 | 4 |
| H01L21/6875 | 4 |
| H01L21/67109 | 4 |
| H01J2237/2007 | 4 |