System and method for in situ temperature measurement

Patent metadata

Field	Value
Publication number	US-10113917-B2
Application number	US-201514934652-A
Country	US
Kind code	B2
Filing date	Nov 6, 2015
Priority date	Nov 6, 2015
Publication date	Oct 30, 2018
Grant date	Oct 30, 2018

Abstract

A system and method for monitoring the temperature of a platen and a workpiece disposed on that platen is disclosed. Since the platen is a dielectric material, its properties, such as resistivity and conductivity, may change as a function of temperature. By understanding the relationship between these parameters and temperature, it may be possible to indirectly determine the temperature of the platen. For example, the platen may be in electrical communication with a power supply, which provides a clamping voltage for the workpiece. By monitoring the current waveform associated with the clamping voltage, it is possible to determine changes in the characteristics of the platen. Based on these changes, the temperature of the platen may be calculated.

First claim

What is claimed is:

1. A system for determining a temperature of a platen, comprising:
the platen comprising at least one electrode;
a power supply to provide a clamping voltage and a clamping current to the at least one electrode, wherein the clamping voltage creates an electrical field that serves to clamp a workpiece to the platen;
a current sensor to monitor the clamping current; and
a controller configured to determine a temperature of the platen based on a parameter of the clamping current.

2. The system of claim 1 , wherein the clamping voltage is a time-varying voltage.

3. The system of claim 2 , wherein the current sensor outputs a clamping current waveform to the controller.

4. The system of claim 3 , wherein the parameter comprises an area under a curve of the clamping current waveform.

5. The system of claim 1 , wherein the controller is further configured to determine the temperature of the platen in response to a type of the platen.

6. The system of claim 1 , wherein the clamping voltage is a constant voltage.

7. The system of claim 6 , wherein the parameter comprises a measure of a leakage current through a dielectric layer of the platen.

8. The system of claim 1 , wherein the current sensor is disposed within the power supply.

9. The system of claim 1 , wherein the controller is further configured to determine the temperature of the platen based on the parameter and an equation, wherein the equation converts the parameter to the temperature of the platen.

10. The system of claim 1 , wherein the controller is further configured to determine the temperature of the platen based on the parameter and data stored in a table, where the table comprises a plurality of values of the parameter and temperature values corresponding to the plurality of values.

11. The system of claim 1 , wherein the controller is further configured to determine the temperature of the workpiece disposed on the platen, based on the parameter and data stored in a table, where the table comprises a plurality of values of the parameter and temperature values corresponding to the plurality of values.

12. The system of claim 1 , further comprising a heating system to heat the platen, wherein the temperature determined by the controller is used to modify an operation of the heating system in situ to optimize the temperature of the platen.

Assignees

• Varian Semiconductor Equipment Ass Inc

Inventors

• Suuronen David E

Classifications

• G01K2217/00

  Temperature measurement using electric or magnetic components already present in the system to be measured · CPC title

• G01K7/16 Primary

  using resistive elements · CPC title