Fan-out semiconductor package having under-bump metallurgy
US-2026040974-A1 · Feb 5, 2026 · US
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Sung Ki Jun patents
Sung Ki Jun is listed as an inventor on 49 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Sung Ki Jun |
| Total patents | 49 |
| First publication | Jun 25, 2015 |
| Latest publication | Feb 5, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Stack packages and methods of manufacturing the same
US-2024234379-A1 · Jul 11, 2024 · US
Stack packages and methods of manufacturing the same
US-2024030192-A1 · Jan 25, 2024 · US
Stack packages and methods of manufacturing the same
US-11804474-B2 · Oct 31, 2023 · US
Semiconductor package including a bridge die
US-11495545-B2 · Nov 8, 2022 · US
Stack packages and methods of manufacturing the same
US-2022293564-A1 · Sep 15, 2022 · US
Semiconductor package including vertical interconnector
US-11444063-B2 · Sep 13, 2022 · US
Semiconductor package including vertical interconnector
US-2022230994-A1 · Jul 21, 2022 · US
System-in-packages including a bridge die
US-11322446-B2 · May 3, 2022 · US
Apparatus and method for inducing safe driving of a surrounding vehicle
US-11127296-B2 · Sep 21, 2021 · US
Recent patents
Latest publications not already listed above.
Stack packages including bridge dies
US-10985106-B2 · Apr 20, 2021 · US
Apparatus and method for inducing safe driving of a surrounding vehicle
US-2021056851-A1 · Feb 25, 2021 · US
Semiconductor packages including bridge die
US-10903196-B2 · Jan 26, 2021 · US
Semiconductor packages including bridge die spaced apart from semiconductor die
US-10903131-B2 · Jan 26, 2021 · US
Stack packages relating to bridge die
US-10811359-B2 · Oct 20, 2020 · US
Semiconductor packages including a thermal conduction network structure
US-2020328189-A1 · Oct 15, 2020 · US
System-in-packages including a bridge die
US-2020273800-A1 · Aug 27, 2020 · US
System-in-packages including a bridge die
US-2020273799-A1 · Aug 27, 2020 · US
Semiconductor package including a bridge die
US-2020273801-A1 · Aug 27, 2020 · US
Stack packages relating to bridge die
US-2020176385-A1 · Jun 4, 2020 · US
Stack packages including bridge dies
US-10658332-B2 · May 19, 2020 · US
Semiconductor packages including a multi-chip stack
US-10643973-B2 · May 5, 2020 · US
Semiconductor packages including bridge die
US-2020091123-A1 · Mar 19, 2020 · US
Stack packages including bridge dies
US-2020075490-A1 · Mar 5, 2020 · US
Stack packages including bridge dies
US-2020075542-A1 · Mar 5, 2020 · US
Chip stack packages
US-10553567-B2 · Feb 4, 2020 · US
Semiconductor packages including bridge die spaced apart from semiconductor die
US-2019333834-A1 · Oct 31, 2019 · US
Chip stack packages
US-2019319009-A1 · Oct 17, 2019 · US
Semiconductor packages including a multi-chip stack and methods of fabricating the same
US-2019221543-A1 · Jul 18, 2019 · US
Semiconductor packages including heat transferring blocks and methods of manufacturing the same
US-10170456-B2 · Jan 1, 2019 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Sk Hynix Inc | 47 |
| Hyundai Motor Co Ltd | 2 |
| Kia Motors Corp | 2 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/00 | 43 |
| H10W90/701 | 35 |
| H10W74/117 | 33 |
| H10W70/60 | 32 |
| H10W90/724 | 32 |