Hybrid substrates, semiconductor packages including the same and methods for fabricating semiconductor packages
US-9620494-B2 · Apr 11, 2017 · US
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Son Daewoo patents
Son Daewoo is listed as an inventor on 3 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Son Daewoo |
| Total patents | 3 |
| First publication | Oct 4, 2016 |
| Latest publication | Apr 11, 2017 |
Notable patents
Publications ranked by popularity score, then publication date.
Recent patents
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Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Samsung Electronics Co Ltd | 3 |
| Son Daewoo | 1 |
| Kim Chulwoo | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/754 | 3 |
| H10W90/732 | 3 |
| H10W90/724 | 3 |
| H10W90/291 | 3 |
| H10W90/271 | 3 |