Integrated circuit die stack with a back-side power delivery network
US-2026096473-A1 · Apr 2, 2026 · US
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Smith Alan D patents
Smith Alan D is listed as an inventor on 23 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Smith Alan D |
| Total patents | 23 |
| First publication | Feb 17, 2022 |
| Latest publication | Apr 2, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Dynamic repartition of memory physical address mapping
US-2026072599-A1 · Mar 12, 2026 · US
Dynamic repartition of memory physical address mapping
US-12436684-B2 · Oct 7, 2025 · US
Chip package with active silicon bridge
US-2025149525-A1 · May 8, 2025 · US
Chip package with multiple hbm stacks
US-2025118719-A1 · Apr 10, 2025 · US
Acceleration unit with modular architecture
US-2025117352-A1 · Apr 10, 2025 · US
Integrated memory controller circuitry
US-2025098181-A1 · Mar 20, 2025 · US
Hardware management of direct memory access commands
US-2024419358-A1 · Dec 19, 2024 · US
Through-silicon via layout for multi-die integrated circuits
US-12107076-B2 · Oct 1, 2024 · US
Unified flexible cache
US-2024220409-A1 · Jul 4, 2024 · US
Recent patents
Latest publications not already listed above.
Systems and methods for chiplet synchronization
US-2024202047-A1 · Jun 20, 2024 · US
DMA engines configured to perform first portion data transfer commands with a first DMA engine and second portion data transfer commands with second DMA engine
US-11995351-B2 · May 28, 2024 · US
Multi-die stacked power delivery
US-11960339-B2 · Apr 16, 2024 · US
Creating interconnects between dies using a cross-over die and through-die vias
US-2024071940-A1 · Feb 29, 2024 · US
Dynamic repartition of memory physical address mapping
US-2023384947-A1 · Nov 30, 2023 · US
Creating interconnects between dies using a cross-over die and through-die vias
US-11830817-B2 · Nov 28, 2023 · US
Through-silicon via layout for multi-die integrated circuits
US-2023207527-A1 · Jun 29, 2023 · US
Dynamic repartition of memory physical address mapping
US-11687251-B2 · Jun 27, 2023 · US
Software management of direct memory access commands
US-2023195664-A1 · Jun 22, 2023 · US
Hardware management of direct memory access commands
US-2023132931-A1 · May 4, 2023 · US
Dynamic repartition of memory physical address mapping
US-2023097344-A1 · Mar 30, 2023 · US
Multi-die stacked power delivery
US-2023009881-A1 · Jan 12, 2023 · US
Creating interconnects between dies using a cross-over die and through-die vias
US-2022051985-A1 · Feb 17, 2022 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Advanced Micro Devices Inc | 23 |
| Ati Technologies Ulc | 14 |
| Ati Tecnologies Ulc | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/00 | 11 |
| H10W90/297 | 8 |
| G06F3/0659 | 8 |
| G06F2212/1024 | 7 |
| H10W90/701 | 6 |