Enclosure structure, electronic device, and enclosure structure preparation method
US-12531332-B2 · Jan 20, 2026 · US
Si Heshuai is listed as an inventor on 19 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Si Heshuai |
| Total patents | 19 |
| First publication | Nov 7, 2019 |
| Latest publication | Jan 20, 2026 |
Publications ranked by popularity score, then publication date.
US-12531332-B2 · Jan 20, 2026 · US
US-12103886-B2 · Oct 1, 2024 · US
US-11847265-B2 · Dec 19, 2023 · US
US-11825614-B2 · Nov 21, 2023 · US
US-2023118584-A1 · Apr 20, 2023 · US
US-11567382-B2 · Jan 31, 2023 · US
US-2022137715-A1 · May 5, 2022 · US
US-11275449-B2 · Mar 15, 2022 · US
US-2022004034-A1 · Jan 6, 2022 · US
US-2021317032-A1 · Oct 14, 2021 · US
Latest publications not already listed above.
US-2021168948-A1 · Jun 3, 2021 · US
US-2021107045-A1 · Apr 15, 2021 · US
US-2021103341-A1 · Apr 8, 2021 · US
US-10913426-B2 · Feb 9, 2021 · US
US-10884510-B2 · Jan 5, 2021 · US
US-10817115-B2 · Oct 27, 2020 · US
US-2019384413-A1 · Dec 19, 2019 · US
US-2019369835-A1 · Dec 5, 2019 · US
US-2019337484-A1 · Nov 7, 2019 · US
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Huawei Tech Co Ltd | 19 |
| Huawei Technoloies Co Ltd | 1 |
Most common classification codes across this inventor's patents.