Enclosure structure, electronic device, and enclosure structure preparation method

Patent metadata

Field	Value
Publication number	US-12531332-B2
Application number	US-202217990447-A
Country	US
Kind code	B2
Filing date	Nov 18, 2022
Priority date	May 21, 2020
Publication date	Jan 20, 2026
Grant date	Jan 20, 2026

Abstract

Embodiments of this application provide an enclosure structure, an electronic device, and an enclosure structure preparation method; and relate to the field of electronic device technologies. The enclosure structure includes an enclosure and an antenna grain line. At least a part of the enclosure is made of a non-metal material to form a non-metal part, the non-metal part has a first surface and a second surface that are opposite to each other, the first surface faces an exterior of the electronic device, and the second surface faces an interior of the electronic device. The antenna grain line is disposed on the first surface; or a groove is disposed on the second surface, and the antenna grain line is disposed in the groove.

First claim

What is claimed is:

1 . An enclosure structure of an electronic device, comprising:
an enclosure, comprising a non-metal part made of a non-metal material, wherein the non-metal part has a first surface and a second surface that are opposite to each other, wherein the first surface faces an exterior of the electronic device, and wherein the second surface faces an interior of the electronic device; and an antenna grain line disposed on the first surface; or a groove disposed on the second surface, wherein the antenna grain line is disposed in the groove, wherein the antenna grain line comprises, in a direction away from the enclosure, a transition layer, a conductive layer, and a corrosion-resistant layer that are disposed in a stacked manner.

2 . The enclosure structure according to claim 1 , further comprising:
a protective layer that covers an exterior of the antenna grain line.

3 . The enclosure structure according to claim 1 , wherein the antenna grain line has a third surface and a fourth surface that are opposite to each other, wherein the fourth surface is in contact with the enclosure, and wherein a vertical projection of the third surface on the fourth surface covers a part of the fourth surface.

4 . The enclosure structure according to claim 1 , wherein a line width of the antenna grain line ranges from 0.5 μm to 1000 μm, and a spacing between two adjacent branches of the antenna grain line ranges from 5 μm to 1000 μm.

5 . The enclosure structure according to claim 1 , wherein when the antenna grain line is disposed on the first surface, a first area is formed on the first surface, wherein a second area is an area other than the first area on the first surface, wherein the antenna grain line on the first surface is located in the first area, wherein an auxiliary grain line is disposed in the second area, wherein the antenna grain line in the first area is connected, and wherein the auxiliary grain line in the second area is disconnected.

6 . The enclosure structure according to claim 1 , wherein when the antenna grain line is disposed in the groove, a bottom surface of the groove comprises a third area and a fourth area, wherein the fourth area is an area other than the third area on the bottom surface of the groove, wherein the antenna grain line in the groove is located in the third area, wherein an auxiliary grain line is disposed in the fourth area, wherein the antenna grain line in the third area is connected, and wherein the auxiliary grain line in the fourth area is disconnected.

7 . The enclosure structure according to claim 1 , wherein when the antenna grain line is disposed on the first surface, a conductive through hole is disposed on the non-metal part; wherein the conductive through hole passes through the first surface and the second surface; wherein a first end of the conductive through hole located on the first surface is electrically connected to the antenna grain line located on the first surface, a second end of the conductive through hole located on the second surface is configured to electrically connect to a first signal line disposed in the electronic device, and wherein the first signal line is electrically connected to an antenna transceiver module.

8 . The enclosure structure according to claim 1 , wherein when the antenna grain line is disposed on the first surface, a second signal line is disposed on the second surface; wherein the second signal line extends to an edge of the second surface and is electrically connected to the antenna grain line located on the first surface; wherein the second signal line is configured to electrically connect to a first signal line disposed in the electronic device, and wherein the first signal line is electrically connected to an antenna transceiver module.

9 . An enclosure structure of an electronic device, comprising:
an enclosure, comprising a non-metal part made of a non-metal material, wherein the non-metal part has a first surface and a second surface that are opposite to each other, wherein the first surface faces an exterior of an electronic device, wherein the second surface faces an interior of the electronic device, a first area is formed on the second surface, and a second area is an area other than the first area on the second surface; an antenna grain line, wherein the antenna grain line is located in the first area and is connected; and an auxiliary grain line, wherein the auxiliary grain line is located in the second area and is disconnected, wherein the antenna grain line and the auxiliary grain line each comprise, in a direction away from the enclosure, a transition layer, a conductive layer, and a corrosion-resistant layer that are disposed in a stacked manner.

10 . The enclosure structure according to claim 9 , wherein the enclosure structure further comprises:
a protective layer that covers exteriors of the antenna grain line and the auxiliary grain line.

11 . The enclosure structure according to claim 9 , wherein line widths of the antenna grain line and the auxiliary grain line each range from 0.5 μm to 1000 μm, wherein a spacing between two adjacent branches of the antenna grain line ranges from 5 μm to 1000 μm, and wherein a spacing between two adjacent branches of the auxiliary grain line ranges from 5 μm to 1000 μm.

12 . An electronic device, comprising:
an enclosure structure comprising:
an enclosure, a non-metal part made of a non-metal material, wherein the non-metal part has a first surface and a second surface that are opposite to each other, wherein the first surface faces an exterior of the electronic device, and wherein the second surface faces an interior of the electronic device; and
an antenna grain line disposed on the first surface; or
a groove disposed on the second surface, wherein the antenna grain line is disposed in the groove,
wherein the antenna grain line comprises, in a direction away from the enclosure, a transition layer, a conductive layer, and a corrosion-resistant layer that are disposed in a stacked manner; and
a circuit board, disposed inside the electronic device, wherein an antenna transceiver module and a first signal line connected to the antenna transceiver module are disposed on the circuit board, and wherein the first signal line is electrically connected to the antenna grain line.

13 . The electronic device according to claim 12 , wherein the antenna grain line is connected to the first signal line through a coupled feeding.

14 . An enclosure structure preparation method, comprising:
disposing an antenna grain line on a first surface, wherein an enclosure structure comprises an enclosure, the enclosure comprises a non-metal part made of a non-metal material, wherein the non-metal part has the first surface and a second surface that are opposite to each other, wherein the first surface faces an exterior of an electronic device, and wherein the second surface faces an interior of the electronic device; or disposing a groove on the second surface, and disposing the antenna grain line in the groove, wherein the disposing the antenna grain line comprises:
disposing, in a direction away from the enclosure, a transition layer, a conductive layer, and a corrosion-resistant layer in a stacked manner, to form the antenna grain line.

15 . The enclosure structure preparation method according to claim 14 , further comprising:
after the antenna grain line is disposed, disposing a protective layer, wherein the protective layer covers an exterior of the antenna grain line.

16 . The enclosure structure preparation method accordin

Assignees

• Huawei Tech Co Ltd

Inventors

• Cui Yongtao
• Yang Yuchan
• Ma Rong
• Si Heshuai

Classifications

• H05K5/0247

  Electrical details of casings, e.g. terminals, passages for cables or wiring · CPC title

• H01Q1/244 Primary

  extendable from a housing along a given path · CPC title

• H01Q1/002

  Protection against seismic waves, thermal radiation or other disturbances, e.g. nuclear explosion; Arrangements for improving the power handling capability of an antenna · CPC title

• H01Q1/38

  formed by a conductive layer on an insulating support {(patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface  H01Q15/142)} · CPC title

• H01Q1/243

  with built-in antennas · CPC title