Method of assembly by direct bonding of electronic components
US-2023207515-A1 · Jun 29, 2023 · US
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Sanchez Loïc patents
Sanchez Loïc is listed as an inventor on 3 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Sanchez Loïc |
| Total patents | 3 |
| First publication | Oct 8, 2015 |
| Latest publication | Jun 29, 2023 |
Notable patents
Publications ranked by popularity score, then publication date.
Method for producing at least one pad assembly on a support for the self-assembly of an integrated circuit chip on the support by the formation of a fluorinated material surrounding the pad and exposure of the pad and the fluorinated material to an ultraviolet treatment in the presence of ozone
US-9240389-B2 · Jan 19, 2016 · US
Method for producing at least one pad assembly on a support for the self-assembly of an integrated circuit chip on the support by the formation of a fluorinated material surrounding the pad and exposure of the pad and the fluorinated material to an ultraviolet treatment in the presence of ozone
US-2015287695-A1 · Oct 8, 2015 · US
Recent patents
Latest publications not already listed above.
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Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Commissariat Energie Atomique | 3 |
| St Microelectronics Crolles 2 | 2 |
| Stmicroelectronics Crolles2 Sas | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W72/0198 | 3 |
| H10W80/165 | 3 |
| H10W80/211 | 3 |
| H10W90/796 | 3 |
| H10W99/00 | 3 |