Method for producing at least one pad assembly on a support for the self-assembly of an integrated circuit chip on the support by the formation of a fluorinated material surrounding the pad and exposure of the pad and the fluorinated material to an ultraviolet treatment in the presence of ozone

Patent metadata

Field	Value
Publication number	US-9240389-B2
Application number	US-201314438668-A
Country	US
Kind code	B2
Filing date	Mar 20, 2013
Priority date	Mar 22, 2012
Publication date	Jan 19, 2016
Grant date	Jan 19, 2016

Abstract

A method for producing at least one pad assembly ( 32, 50 ) on a support ( 19, 43 ) for use in a method for self-assembling at least one element ( 10 ) on the support ( 19, 43 ), comprises fanning, on the support ( 19, 43 ), a layer ( 28, 48 ) of at least one fluorinated material around the location ( 30, 44 ) of the pad assembly ( 32, 50 ), the layer ( 28, 48 ) having a thickness greater than 10 nm. The layer ( 28, 48 ) and the location ( 30, 44 ) are exposed to an ultraviolet treatment in the presence of ozone to form the pad assembly ( 32, 50 ) at said location ( 30, 44 ), wherein a drop of liquid ( 16 ) having a static contact angle on the pad assembly ( 32, 50 ) less than or equal to 15°, after the exposure to the ultraviolet treatment, has a static contact angle on the layer ( 28, 48 ) greater than or equal to 100°.

First claim

The invention claimed is:

1. A method for manufacturing at least one assembly pad on a support intended for the implementation of a method of self-assembly of at least one element ( 10 ) on the support, the manufacturing method comprising the successive steps of:
(a) forming, on the support, a layer of at least one fluorinated material around the location of the assembly pad; the layer having a thickness higher than 10 nm; and
(b) submitting the layer and the location to an ultraviolet processing in the presence of ozone to form the assembly pad at said location surrounded with said layer, a drop of demineralized water having a static contact angle on the assembly pad lower or equal to 15°, the demineralized water drop having, after step b), a static contact angle higher or equal to 100°.

2. The method of claim 1 , wherein the fluorinated material is a fluorocarbon material.

3. The method of claim 1 , wherein step (a) comprises exposing the support to a plasma based on octafluorobutene, hexafluoroethane, carbon tetrafluoride, and/or trifluoromethane.

4. The method of claim 1 , further comprising the steps of:
(c) forming a resin portion on the support at said location before step (a); and
(d) removing the resin portion before step (b).

5. The method of claim 4 , further comprising, after step (c) and before step (a), a step of etching the support to form a protrusion under the resin portion ( 26 ).

6. The method of claim 1 , wherein the support comprises a semiconductor material substrate having the fluorinated material layer formed thereon, the method further comprising a step of forming an oxide layer of the semiconductor material on the substrate before step (a).

7. The method of claim 1 , further comprising the steps of:
(e) depositing a drop of a liquid on the assembly pad; and
(f) bringing the element in contact with the drop, whereby the element is self-assembled with respect to the support.

8. The method of claim 7 , wherein the element is an integrated circuit chip.

9. The method of claim 7 , further comprising the steps of:
(g) drying the drop; and
(h) bonding the element to the support.

10. The method of claim 9 , wherein step (h) comprises a step of molecular bonding of the element to the assembly pad.

11. A support intended for the implementation of a method of self-assembly of at least one element on the support, comprising:
at least one assembly pad, a liquid drop having a static contact angle on the assembly pad smaller than or equal to 15°; and
a layer at least one fluorinated material around the assembly pad, the liquid drop having a static contact angle on the layer greater than or equal to 100°.

12. The support of claim 11 , wherein the liquid drop has a static contact angle on the assembly pad smaller than or equal to 10° and has a static contact angle on the layer greater than or equal to 110°.

13. The support of claim 11 , wherein the fluorinated material is a fluorocarbon material.

14. The support of claim 11 , further comprising a protrusion comprising sides and a top, the assembly pad being on the top and the layer covering the sides.

15. The support of claim 14 , wherein the sides are inclined by more than 45° with respect to the top.

16. The support of claim 11 , further comprising a substrate, the assembly pad and the layer being formed on the substrate, the substrate being made of a semiconductor material, the assembly pad comprising an oxide of the semiconductor material.

Assignees

• Commissariat Energie Atomique
• St Microelectronics Crolles 2
• Stmicroelectronics Crolles2 Sas

Inventors

• DI CIOCCIO LéA
• Mermoz Sébastien
• Sanchez Loïc

Classifications

• H10W72/0198

  batch processes · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W72/073

  of die-attach connectors · CPC title

• H10W72/953

  not comprising solid metals or solid metalloids, e.g. polymers, ceramics or liquids · CPC title

• H10W80/334

  Thermocompression bonding · CPC title