Wafer chuck designs and methods for retaining a processing liquid on a surface of a semiconductor wafer
US-12506019-B2 · Dec 23, 2025 · US
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Robison Rodney patents
Robison Rodney is listed as an inventor on 6 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Robison Rodney |
| Total patents | 6 |
| First publication | Oct 29, 2020 |
| Latest publication | Dec 23, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Wafer processing method and system using heated functional plate
US-2025308950-A1 · Oct 2, 2025 · US
Novel Wafer Chuck Designs And Methods For Retaining A Processing Liquid On A Surface Of A Semiconductor Wafer
US-2025285883-A1 · Sep 11, 2025 · US
Wet Processing Systems Having Novel Wafer Chuck Designs For Retaining A Processing Liquid On A Surface Of A Semiconductor Substrate
US-2025285884-A1 · Sep 11, 2025 · US
Point-of-use dynamic concentration delivery system with high flow and high uniformity
US-11383211-B2 · Jul 12, 2022 · US
Point-of-use dynamic concentration delivery system with high flow and high uniformity
US-2020338510-A1 · Oct 29, 2020 · US
Recent patents
Latest publications not already listed above.
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Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Tokyo Electron Ltd | 6 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10P72/0414 | 5 |
| H10P72/722 | 3 |
| H10P72/78 | 3 |
| H10P72/7611 | 3 |
| H10P72/7608 | 3 |