Molded semiconductor package with high voltage isolation
US-11817407-B2 · Nov 14, 2023 · US
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Reynoso Dexter patents
Reynoso Dexter is listed as an inventor on 6 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Reynoso Dexter |
| Total patents | 6 |
| First publication | Apr 2, 2020 |
| Latest publication | Nov 14, 2023 |
Notable patents
Publications ranked by popularity score, then publication date.
Molded semiconductor package with high voltage isolation
US-2022278060-A1 · Sep 1, 2022 · US
Molded semiconductor package with high voltage isolation
US-2022181280-A1 · Jun 9, 2022 · US
Molded semiconductor package with high voltage isolation
US-11355460-B1 · Jun 7, 2022 · US
Multi-clip structure for die bonding
US-11189592-B2 · Nov 30, 2021 · US
Multi-Clip Structure for Die Bonding
US-2020105707-A1 · Apr 2, 2020 · US
Recent patents
Latest publications not already listed above.
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Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Infineon Technologies Ag | 4 |
| Infineon Technologies Austria Ag | 2 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W74/00 | 6 |
| H10W72/076 | 6 |
| H10W90/736 | 6 |
| H10W72/652 | 6 |
| H10W74/111 | 6 |