Device, method and system for providing recessed interconnect structures of a substrate
US-11355427-B2 · Jun 7, 2022 · US
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Prabhakumar Ananth patents
Prabhakumar Ananth is listed as an inventor on 5 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Prabhakumar Ananth |
| Total patents | 5 |
| First publication | May 2, 2019 |
| Latest publication | Jun 7, 2022 |
Notable patents
Publications ranked by popularity score, then publication date.
Integrated circuit package with through void guard trace
US-2022148981-A1 · May 12, 2022 · US
Integrated circuit package with through void guard trace
US-11264338-B2 · Mar 1, 2022 · US
Integrated circuit package with through void guard trace
US-2019295961-A1 · Sep 26, 2019 · US
Device, method and system for providing recessed interconnect structures of a substrate
US-2019131227-A1 · May 2, 2019 · US
Recent patents
Latest publications not already listed above.
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Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Intel Corp | 5 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/724 | 5 |
| H10W20/493 | 3 |
| H10W44/00 | 3 |
| H10W42/00 | 3 |
| H10W70/685 | 3 |