Package for integrated circuit with heat dissipation
US-2025079259-A1 · Mar 6, 2025 · US
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Petit Luc patents
Petit Luc is listed as an inventor on 7 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Petit Luc |
| Total patents | 7 |
| First publication | Apr 14, 2015 |
| Latest publication | Mar 6, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Integrated circuit packages
US-2023411271-A1 · Dec 21, 2023 · US
Electronic device comprising an encapsulating block locally of smaller thickness
US-10186466-B2 · Jan 22, 2019 · US
Electronic device comprising an encapsulating block locally of smaller thickness
US-2018033710-A1 · Feb 1, 2018 · US
Electronic device comprising an encapsulating block locally of smaller thickness
US-9818664-B2 · Nov 14, 2017 · US
Electronic device comprising an encapsulating block locally of smaller thickness
US-2017250119-A1 · Aug 31, 2017 · US
Dual side package on package
US-9006904-B2 · Apr 14, 2015 · US
Recent patents
Latest publications not already listed above.
No data yet.
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Stmicroelectronics (Grenoble 2) Sas | 3 |
| St Microelectronics Grenoble 2 | 3 |
| St Microelectronics Int Nv | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/724 | 7 |
| H01L2224/16225 | 6 |
| H10W70/65 | 5 |
| H01L2924/15311 | 5 |
| H01L23/49838 | 5 |