Thermally improved PCB for semiconductor power die connected by via technique and assembly using such PCB
US-12532416-B2 · Jan 20, 2026 · US
Perrin Remi is listed as an inventor on 13 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Perrin Remi |
| Total patents | 13 |
| First publication | Feb 1, 2018 |
| Latest publication | Jan 20, 2026 |
Publications ranked by popularity score, then publication date.
US-12532416-B2 · Jan 20, 2026 · US
US-2025294680-A1 · Sep 18, 2025 · US
US-2024237208-A1 · Jul 11, 2024 · US
US-2024154577-A1 · May 9, 2024 · US
US-11217571-B2 · Jan 4, 2022 · US
US-11180606-B2 · Nov 23, 2021 · US
US-11180605-B2 · Nov 23, 2021 · US
US-2021143103-A1 · May 13, 2021 · US
US-2021043613-A1 · Feb 11, 2021 · US
US-2019194379-A1 · Jun 27, 2019 · US
Latest publications not already listed above.
US-2019194380-A1 · Jun 27, 2019 · US
US-2019194378-A1 · Jun 27, 2019 · US
US-2018030196-A1 · Feb 1, 2018 · US
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Mitsubishi Electric Corp | 7 |
| Centre Nat Rech Scient | 6 |
| Univ Strasbourg | 6 |
| Tereos Starch & Sweeteners Belgium | 5 |
| Soc Soprema Sas | 5 |
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| C08J2375/04 | 6 |
| C08G2110/0025 | 6 |
| H10W90/401 | 6 |
| C08J9/125 | 5 |
| C07C69/44 | 5 |