Power module

Patent metadata

Field	Value
Publication number	US-2025294680-A1
Application number	US-202218858980-A
Country	US
Kind code	A1
Filing date	Oct 28, 2022
Priority date	Jun 9, 2022
Publication date	Sep 18, 2025
Grant date	—

Abstract

A power module having a first integrated power board having a first positive terminal, a first power semiconductor die, a first middle point terminal, a second power semiconductor die and a first negative terminal, a second integrated power board having a second positive terminal, another first power semiconductor die, a second middle point terminal, another second power semiconductor die and a second negative terminal, a PCB busbar having opposite first face and second face and having power conductive tracks and connection pads, on both said first face and said second face, wherein said first integrated power board has its first positive terminal, first middle point terminal and first negative terminal connected to connection pads on said first face, wherein said second integrated power board has its first positive terminal, first middle point terminal and first negative terminal connected to further connection pads on said second face.

First claim

1 . A power module, having:
at least a pair of integrated power boards each having at least two embedded power semiconductor dies, a first integrated power board of said pair having in line a first positive terminal, a first power semiconductor die, a first middle point terminal, a second power semiconductor die and a first negative terminal and having a first current flow direction from said first negative terminal to said first positive terminal through said first power semiconductor, said first middle point terminal and said second semiconductor, a second integrated power board of said pair having in line a second positive terminal, another first power semiconductor die, a second middle point terminal, another second power semiconductor die and a second negative terminal and having a second current flow direction from said second negative terminal to said second positive terminal through said another first power semiconductor, said second middle point terminal and said another second semiconductor and, a PCB busbar, to provide a positive voltage BUS+, and a negative voltage BUS− current supply to said first and second integrated power boards, having opposite first face and second face and having power conductive tracks and connection pads, on both said first face and said second face, wherein said first integrated power board is positioned on said first face of the PCB busbar and has its first positive terminal, first middle point terminal and first negative terminal connected to connection pads on said first face of said PCB busbar, wherein said second integrated power board is positioned on said second face of the PCB busbar has its first positive terminal, first middle point terminal and first negative terminal connected to further connection pads on said second face of said PCB busbar and wherein said first integrated power board and said second integrated power board are oriented head to tail to have the first current flow direction and the second current flow direction in opposite directions.

2 . The power module for a power converter according to claim 1 wherein the PCB busbar comprises at least one positive voltage distribution conductive track and at least one negative voltage distribution conductive track isolated from each other with an isolation substrate and comprises on a first side of the PCB busbar:
on the first face of the PCB busbar a first connection area to connect said positive voltage distribution conductive track to the positive voltage BUS+, said first connection area being connected to a first connecting pad on the first face of the PCB busbar to connect the first positive terminal of the first integrated power board, and to a second connecting pad on the second face of the PCB busbar to connect the second positive terminal, through said positive voltage distribution conductive track and through first vias in the PCB busbar;
on the second face of the PCB busbar a second connection area to connect said negative voltage distribution conductive track to a negative voltage BUS+, said second connection area being connected to a third connecting pad on the second face of the PCB busbar to connect the second negative terminal and to a fourth connecting pad on the first face to connect the first negative terminal, through said negative voltage distribution conductive track and through second vias in the PCB.

3 . The power module for a power converter according to claim 2 wherein the PCB busbar comprises further at least one third connection area to provide an output electrical connection on a second side of the PCB busbar and comprises:
at least one output connecting track, output connecting vias and output connecting pads to connect said first middle point terminal on the first face of the PCB and said second middle point terminal on the second face of the PCB.

4 . The power module for a power converter according to claim 3 wherein said first side is a first longitudinal side of said PCB busbar and said second side is a first lateral side of said PCB busbar.

5 . The power module for a power converter according to claim 1 , wherein the power semiconductor dies comprise gate terminals or base terminals connected to gate or base control terminals on the PCB busbar through gate or base connection pads, and gate or base connection tracks.

6 . The power module for a power converter according to claim 1 comprising further integrated power boards located by pairs on said opposite first face and second face of the PCB, sidewise to the first pair of integrated power boards and connected to the PCB busbar tracks.

7 . The power module for a power converter according to claim 6 where the integrated power boards are oriented so that the current directions of each integrated power board is the opposite of the current direction of its closest neighbors.

8 . The power module for a power converter according to claim 1 , wherein parasitic RLC elements are adjusted within the PCB busbar with an adaptation of the thickness of insulating and conductive layers of the PCB busbar.

9 . The power module for a power converter according to claim 2 , wherein the PCB busbar comprises a main decoupling capacitor connected to said positive voltage distribution conductive tracks and negative voltage distribution conductive tracks and located on contact pads on a third side of the PCB busbar.

10 . The power module for a power converter according to claim 1 , comprising at least one additional silicon decoupling capacitor within the busbar substrate.

11 . The power module for a power converter according to claim 1 , comprising heatsinks on said integrated power boards.

12 . The power module for a power converter according to claim 1 , wherein each pair of integrated power boards form a half bridge.

13 . The power module according to claim 1 , wherein all pairs of integrated power boards are connected in parallel to form a single half bridge.

Assignees

• Mitsubishi Electric Corp

Inventors

• Perrin Remi
• Lefevre Guillaume

Classifications

• H10W44/501

  Inductive arrangements (H10W44/20 takes precedence) · CPC title

• H10W90/796

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W70/614

  the multiple chips being integrally enclosed · CPC title

• H10W90/401

  characterised by multiple insulating or insulated package substrates, interposers or RDLs · CPC title