Substrate processing apparatus and substrate processing method using the same
US-12592366-B2 · Mar 31, 2026 · US
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Park Sumin patents
Park Sumin is listed as an inventor on 14 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Park Sumin |
| Total patents | 14 |
| First publication | Feb 22, 2018 |
| Latest publication | Mar 31, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Measuring apparatus for semiconductor device and measuring method using the same
US-12523696-B2 · Jan 13, 2026 · US
Compound, binder resin, negative-type photosensitive resin composition, and display device comprising black bank formed using same
US-12441840-B2 · Oct 14, 2025 · US
Measuring apparatus for semiconductor device and measuring method using the same
US-2024353484-A1 · Oct 24, 2024 · US
Semiconductor device and method of manufacturing the semiconductor device
US-2024274593-A1 · Aug 15, 2024 · US
Layout method of semiconductor, inspection method of wafer, manufacturing method of the wafer and manufacturing method of multi-chip package
US-2024071841-A1 · Feb 29, 2024 · US
Substrate processing apparatus and substrate processing method using the same
US-2023282453-A1 · Sep 7, 2023 · US
Compound, binder resin, negative-type photosensitive resin composition, and display device comprising black bank formed using same
US-2023236504-A1 · Jul 27, 2023 · US
Binder resin, positive-type photosensitive resin composition, insulating film and semiconductor device
US-11687002-B2 · Jun 27, 2023 · US
Plasma baffle, substrate processing apparatus including the same, and substrate processing method using the same
US-2023187185-A1 · Jun 15, 2023 · US
Recent patents
Latest publications not already listed above.
Compound, binder resin, negative-type photosensitive resin composition, and display device comprising black bank formed using same
US-2022348716-A1 · Nov 3, 2022 · US
Binder resin, positive-type photosensitive resin composition, insulating film and semiconductor device
US-2022043349-A1 · Feb 10, 2022 · US
Electrical clamping apparatus
US-10544813-B2 · Jan 28, 2020 · US
Electrical clamping apparatus
US-2018051725-A1 · Feb 22, 2018 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Samsung Electronics Co Ltd | 7 |
| Lg Chemical Ltd | 5 |
| Energium Co Ltd | 2 |
| Seoul Nat Univ R&Db Foundation | 2 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| G03F7/40 | 3 |
| C09D175/04 | 3 |
| H01J37/32642 | 3 |
| H10P74/203 | 3 |
| G03F7/105 | 3 |