Binder resin, positive-type photosensitive resin composition, insulating film and semiconductor device

Patent metadata

Field	Value
Publication number	US-11687002-B2
Application number	US-202117390280-A
Country	US
Kind code	B2
Filing date	Jul 30, 2021
Priority date	Jul 30, 2020
Publication date	Jun 27, 2023
Grant date	Jun 27, 2023

Abstract

The present specification relates to a binder resin, a photosensitive resin composition, an insulating film and a semiconductor device.

First claim

The invention claimed is:

1. A binder resin comprising a structure in which a compound of the following Chemical Formula 1 and a dianhydride compound are polymerized:

in Chemical Formula 1,
L is —O—; a substituted or unsubstituted alkylene group; or a substituted or unsubstituted arylene group,
l is an integer from 1 to 10,
when l is 2 or higher, L's are the same as or different from each other,
Ra and Rb are the same as or different from each other, and are each independently hydrogen; or a substituted or unsubstituted alkyl group,
ra and rb are the same as or different from each other, and are each independently an integer from 0 to 4, and when ra is 2 or higher, Ra's are the same as or different from each other, and when rb is 2 or higher, Rb's are the same as or different from each other, and
wherein the dianhydride compound is an oxydiphthalic anhydride (ODPA).

2. The binder resin of claim 1 , wherein L is a substituted or unsubstituted alkylene group.

3. The binder resin of claim 1 , wherein (L)1 is represented by the following Chemical Formula 2:

in Chemical Formula 2,
means a moiety linked to Chemical Formula 1,
L1 is —O—; a substituted or unsubstituted alkylene group; or a substituted or unsubstituted arylene group,
R1 and R2 are the same as or different from each other, and are each independently hydrogen; or a substituted or unsubstituted alkyl group, and
r1 and r2 are the same as or different from each other, and are each independently an integer from 0 to 4, and when r1 and r2 are each 2 or higher, R1 and R2 are each the same as or different from each other.

4. The binder resin of claim 1 , wherein a compound of the following Chemical Formula A; or a compound of the following Chemical Formula A1 is further polymerized:

in Chemical Formulae A and A1,
La is a direct bond; a substituted or unsubstituted alkylene group; a substituted or unsubstituted arylene group; or —SO 2 —,
R11 and R12 are the same as or different from each other, and are each independently hydrogen; a hydroxyl group; or a substituted or unsubstituted alkyl group,
r11 and r12 are the same as or different from each other, and are each independently an integer from 1 to 4, and when r11 is 2 or higher, R11's are the same as or different from each other, and when r12 is 2 or higher, R12's are the same as or different from each other,
R′ and R″ are the same as or different from each other, and are each independently hydrogen; or —(C═O)Rn,
Rn is a substituted or unsubstituted aryl group,
A1 is —O—; —Si(R′″R″″)—; a substituted or unsubstituted alkylene group; a substituted or unsubstituted cycloalkylene group; or a substituted or unsubstituted arylene group,
R′″ and R″″ are the same as or different from each other, and are each independently a substituted or unsubstituted alkyl group, and
a1 is an integer from 1 to 5, and when al is 2 or higher, A1's are the same as or different from each other.

5. The binder resin of claim 1 , wherein a compound of the following Chemical Formula B or a compound of the following Chemical Formula B1 is further polymerized:

in Chemical Formulae B and B1,
Cy is a substituted or unsubstituted aromatic ring or a substituted or unsubstituted aliphatic ring,
B1 is hydrogen or a hydroxyl group, and
b1 is an integer from 1 to 5, and when b1 is 2 or higher, B1's are the same as or different from each other.

6. The binder resin of claim 1 , wherein the binder resin has a weight average molecular weight of 1,000 g/mol to 70,000 g/mol.

7. A positive-type photosensitive resin composition comprising: the binder resin of claim 1 ; a photo active compound; a cross-linking agent; a surfactant; and a solvent.

8. The positive-type photosensitive resin composition of claim 7 , wherein based on 100 parts by weight of the binder resin, the positive-type photosensitive resin composition comprises:
10 parts by weight to 40 parts by weight of the photo active compound;
5 parts by weight to 50 parts by weight of the cross-linking agent;
0.05 part by weight to 5 parts by weight of the surfactant; and
50 parts by weight to 300 parts by weight of the solvent.

9. An insulating film comprising the positive-type photosensitive resin composition of claim 7 or a cured product thereof.

10. A semiconductor device comprising the insulating film of claim 9 .

Assignees

• Lg Chemical Ltd

Inventors

• Park Sumin
• Lim Minyoung

Classifications

• G03F7/0392 Primary

  the macromolecular compound being present in a chemically amplified positive photoresist composition · CPC title

• C08L2203/20

  use in electrical or conductive gadgets · CPC title

• C08L79/08

  Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors · CPC title

• G03F7/039 Primary

  Macromolecular compounds which are photodegradable, e.g. positive electron resists (G03F7/075 takes precedence; macromolecular quinonediazides G03F7/023) · CPC title

• C08G73/1042 Primary

  Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds · CPC title