Electroless surface treatment plated layers of printed circuit board and method for preparing the same
US-9743508-B2 · Aug 22, 2017 · US
This page is not indexed by search engines while we improve data quality.
Pang Jung Youn patents
Pang Jung Youn is listed as an inventor on 5 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Pang Jung Youn |
| Total patents | 5 |
| First publication | Feb 3, 2015 |
| Latest publication | Aug 22, 2017 |
Notable patents
Publications ranked by popularity score, then publication date.
Electroless surface treatment plated layers of printed circuit board and method for preparing the same
US-2015382452-A1 · Dec 31, 2015 · US
Electroless surface treatment plated layers of printed circuit board and method for preparing the same
US-9150002-B2 · Oct 6, 2015 · US
Printed circuit board and method for manufacturing the same
US-2015136466-A1 · May 21, 2015 · US
Electrode pad, printed circuit board using the same, and method of manufacturing printed circuit board
US-8946911-B2 · Feb 3, 2015 · US
Recent patents
Latest publications not already listed above.
No data yet.
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Samsung Electro Mech | 5 |
| Lee Dong Jun | 1 |
| Jeon Dong Ju | 1 |
| Pang Jung Youn | 1 |
| Cho Seong Min | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| C23C18/54 | 4 |
| B32B15/018 | 4 |
| H05K3/244 | 4 |
| C23C18/1651 | 4 |
| H10W72/5522 | 3 |