Method of assembling a semiconductor power module component and a semiconductor power module with such a module component and manufacturing system therefor
US-2021013175-A1 · Jan 14, 2021 · US
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Osterwald Frank patents
Osterwald Frank is listed as an inventor on 2 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Osterwald Frank |
| Total patents | 2 |
| First publication | Apr 14, 2020 |
| Latest publication | Jan 14, 2021 |
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Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Heraeus Deutschland Gmbh & Co Kg | 1 |
| Danfoss Silicon Power Gmbh | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H01L24/29 | 2 |
| H01L24/75 | 2 |
| H01L24/83 | 2 |
| H10W72/07141 | 2 |
| H10W72/07331 | 2 |