Methods for upper platen manufacturing

Patent metadata

Field	Value
Publication number	US-2024307963-A1
Application number	US-202318183000-A
Country	US
Kind code	A1
Filing date	Mar 13, 2023
Priority date	Mar 13, 2023
Publication date	Sep 19, 2024
Grant date	—

Abstract

Embodiments of the disclosure provided herein include an apparatus and method for additive manufacturing a component for a semiconductor processing apparatus. The apparatus for additive manufacturing includes a printhead configured to selectively deposit layers on build the component, wherein the printhead may selectively deposit a first set of layers onto the build platform, and selectively deposit a second set of layers on the first set of layers, each of the second set of layers comprising a gap that forms a cooling channel through the component. The cooling channel is filled a filler material. A third set of layers covers the cooling channel before the channel is exposed to a liquidizing agent, wherein the liquidizing agent reacts with the filler material to produce an effluent fluid which is then drained. In other embodiments, the cooling channel may be machined into the component before being filled with the filler material.

First claim

What is claimed is:

1 . An apparatus for additive manufacturing a component for a semiconductor processing apparatus, comprising:
a build platform; a printhead configured to selectively deposit layers on the build platform; a controller configured to control operation of the apparatus and further configured to:
selectively deposit a first set of layers onto the build platform using the printhead;
selectively deposit a second set of layers on the first set of layers using the printhead, each of the second set of layers comprising at least one gap, wherein the first set of layers and the second set of layers form the component, and wherein the at least one gap forms at least one cooling channel through the component; and
selectively deposit a filler material in the at least one cooling channel.

2 . The apparatus of claim 1 , wherein the controller is further configured to fill the at least one cooling channel with a liquidizing agent, wherein the liquidizing agent reacts with the filler material to produce an effluent fluid.

3 . The apparatus of claim 1 , wherein the controller is further configured to cause the printhead to selectively depositing a third set of layers on the second set of layers such that the third set of layers cover the at least one gap.

4 . The apparatus of claim 1 , wherein the first set of layers is selectively deposited by depositing a first powder on the build platform and the second set of layers is selectively deposited by depositing a second powder on the build platform.

5 . The apparatus of claim 1 , wherein the first set of layers and second set of layers are selectively deposited by super-heating a polymer material onto a build platform.

6 . The apparatus of claim 1 , wherein the first set of layers and second set of layers are selectively deposited by curing layers of a resin.

7 . The apparatus of claim 1 , wherein the first set of layers and the second set of layers comprise aluminum, stainless steel, or a combination thereof.

8 . A method, of manufacturing a component for a semiconductor processing apparatus, comprising:
selectively depositing a first set of layers using an additive manufacturing apparatus; and selectively depositing a second set of layers on the first set of layers, each of the second set of layers comprising at least one gap, wherein the first set of layers and the second set of layers form the component, and wherein the at least one gap forms at least one cooling channel through the component; and selectively deposit a filler material in the at least one cooling channel.

9 . The method of claim 8 , the method further comprising filling the at least one cooling channel with a liquidizing agent, wherein the liquidizing agent reacts with the filler material to produce an effluent fluid.

10 . The method of claim 8 , further comprising:
selectively depositing a third set of layers on the second set of layers such that the third set of layers cover the at least one gap.

11 . The method of claim 8 , wherein selectively depositing the first set of layers comprises depositing a first powder on a build platform and the second set of layers comprises depositing a second powder on the build platform.

12 . The method of claim 8 , wherein selectively depositing the first set of layers and second set of layers comprises super-heating a polymer material onto a build platform.

13 . The method of claim 8 , wherein selectively depositing the first set of layers and second set of layers comprises curing layers of a resin.

14 . The method of claim 8 , wherein the first set of layers comprises aluminum, stainless steel, or a combination thereof.

15 . A method of manufacturing a component for a semiconductor processing apparatus, comprising:
machining at least one cooling channel into a surface of a component main body; filling the at least one cooling channel with a filler material; depositing layers over a surface of the component main body to form a cover over the filler material; filling the at least one cooling channel with a liquidizing agent, wherein the liquidizing agent reacts with the filler material to produce an effluent fluid; and draining the effluent fluid from the at least one cooling channel.

16 . The method of claim 15 , wherein the layers of the cover are deposited using an additive manufacturing process, and wherein the component is an upper platen of a chemical mechanical polishing apparatus.

17 . The method of claim 15 , wherein depositing the layers of the cover comprises depositing a powder on the component main body deposited on a build platform using an additive manufacturing apparatus.

18 . The method of claim 15 , wherein depositing the layers of the cover comprises super-heating a polymer material onto the component main body deposited on a build platform using an additive manufacturing apparatus.

19 . The method of claim 15 , wherein depositing the layers of the cover comprises curing layers of a resin.

20 . The method of claim 15 , wherein the component main body comprises aluminum, stainless steel, or a combination thereof.

Assignees

• Applied Materials Inc

Inventors

• Xue Ximeng
• Lischka David J
• Gurusamy Jay
• Zuniga Steven M
• Oh Jeonghoon
• Rangarajan Jagan

Classifications

• B22F10/68

  Cleaning or washing · CPC title

• B22F10/14

  by jetting of binder onto a bed of metal powder · CPC title

• B22F12/55

  Two or more means for feeding material · CPC title

• B22F10/28 Primary

  Powder bed fusion, e.g. selective laser melting [SLM] or electron beam melting [EBM] · CPC title

• B33Y30/00

  Apparatus for additive manufacturing; Details thereof or accessories therefor · CPC title