Gas amplifier for cmp cooling

Patent metadata

Field	Value
Publication number	US-2025073850-A1
Application number	US-202418811633-A
Country	US
Kind code	A1
Filing date	Aug 21, 2024
Priority date	Aug 28, 2023
Publication date	Mar 6, 2025
Grant date	—

Abstract

A chemical mechanical polishing chamber may include a platen disposed within the chemical mechanical polishing chamber, the platen configured to support a polishing pad. The chamber may also include a slurry delivery arm configured to deliver a slurry to the polishing pad during a chemical mechanical polishing process. The chamber may include an arm may include one or more brackets, mechanically attached to an internal side of the chemical mechanical polishing chamber and positioned over the platen. The chamber may include a plurality of nozzles configured to deliver a gas to the polishing pad, the plurality of nozzles mechanically attached to the one or more brackets of the arm, each of the plurality of nozzles oriented such that an air gap is disposed between adjacent nozzles of the plurality of nozzles such that air may be pulled from the air gap and propelled with the gas towards the polishing pad.

First claim

What is claimed is:

1 . A chemical mechanical polishing chamber comprising:
a platen disposed within the chemical mechanical polishing chamber, the platen configured to support a polishing pad; a slurry delivery arm configured to deliver a slurry to the polishing pad during a chemical mechanical polishing process; an arm comprising one or more brackets, mechanically attached to an internal side of the chemical mechanical polishing chamber and positioned over the platen; and a plurality of nozzles configured to deliver a gas to the polishing pad, the plurality of nozzles mechanically attached to the one or more brackets of the arm, each of the plurality of nozzles oriented such that an air gap is disposed between adjacent nozzles of the plurality of nozzles such that air may be pulled from the air gap and propelled with the gas towards the polishing pad.

2 . The chemical mechanical polishing chamber of claim 1 , further comprising a manifold disposed above the plurality of nozzles configured to provide air to the plurality of nozzles.

3 . The chemical mechanical polishing chamber of claim 1 , wherein the gas comprises nitrogen.

4 . The chemical mechanical polishing chamber of claim 1 , further comprising a manifold fluidly connected to each of the plurality of nozzles, the manifold configured to deliver a pressurized gas.

5 . The chemical mechanical polishing chamber of claim 1 , wherein each of the plurality of nozzles includes a chamfer configured to direct the gas into a respective nozzle to increase a volume of gas delivered to the polishing pad via the respective nozzle.

6 . A gas amplifying nozzle for a chemical mechanical polishing chamber, the gas amplifying nozzle comprising:
a main chamber; a first opening at a top of the gas amplifying nozzle, configured to allow air to enter the main chamber; a chamfer attached to the top end of the gas amplifying nozzle, configured to direct air into the main chamber of the nozzle; a side chamber configured to receive a pressurized gas and comprising an opening to provide the pressurized gas to the main chamber of the gas amplifying nozzle; and a second opening at a bottom of the gas amplifying nozzle to direct an outflow comprising the air and pressurized gas from the main chamber to a platen to cool a polishing pad.

7 . The gas amplifying nozzle of claim 6 , wherein the pressurized gas is received via a manifold fluidly connected to the gas amplifying nozzle.

8 . The gas amplifying nozzle of claim 6 , wherein the outflow comprises water.

9 . The gas amplifying nozzle of claim 6 , wherein the air surrounding the gas amplifying nozzle is entrained in the outflow directed to the polishing pad.

10 . The gas amplifying nozzle of claim 6 , wherein the pressurized gas comprises nitrogen.

11 . The gas amplifying nozzle of claim 6 , wherein the second opening comprises a diameter of about 1 cm.

12 . The gas amplifying nozzle of claim 6 , wherein the air is directed into the chamfer, at least in part by a fan.

13 . The gas amplifying nozzle of claim 6 , wherein the pressurized gas increases a velocity of the outflow of the air and the pressurized gas from the main chamber.

14 . A method, comprising:
moving a substrate via a carrier onto a polishing pad supported by a platen within a chemical mechanical polishing chamber; providing a slurry to the polishing pad and/or the substrate, the slurry comprising one or more compounds to perform chemical mechanical processing; rotating the platen such that the slurry and the polishing pad removes material from the substrate; providing a first fluid to a nozzle; and providing a second fluid to the nozzle such that the second fluid combines with the first fluid and a gas surrounding the nozzle to form an outflow, the outflow directed towards the substrate and/or polishing pad.

15 . The method of claim 14 , wherein the outflow comprises an atomized fluid comprising water.

16 . The method of claim 14 , wherein the outflow cools the substrate and/or the polishing pad to less than or about 37° C.

17 . The method of claim 16 , wherein the substrate and/or the polishing pad are cooled to less than or about 37° C. in less than or about 10 seconds.

18 . The method of claim 14 , wherein the second fluid comprises pressurized nitrogen.

19 . The method of claim 14 , wherein at least a portion of the first fluid is drawn into the nozzle from the chemical mechanical polishing chamber via a chamfer.

20 . The method of claim 14 , wherein the substrate and/or the polishing pad are cooled to less than or about 30° C.

Assignees

• Applied Materials Inc

Inventors

• Wu Haosheng
• Chang Shou-Sung
• Diep Priscilla
• Chen Hui
• Chou Chih Chung
• Oh Jeonghoon
• Tang Jianshe
• Brown Brian J

Classifications

• H10P52/402 Primary

  of semiconductor materials · CPC title

• B24B37/34

  Accessories · CPC title

• B24B37/015

  Temperature control · CPC title

• B24B57/02

  for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents · CPC title

• B24B55/02

  Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant (cooling or lubricating during dressing operation B24B53/095; incorporated in grinding wheels B24D) · CPC title