Power module substrate, power module, and method for manufacturing power module substrate
US-10763184-B2 · Sep 1, 2020 · US
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Ochiai Kensou patents
Ochiai Kensou is listed as an inventor on 8 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Ochiai Kensou |
| Total patents | 8 |
| First publication | Dec 7, 2017 |
| Latest publication | Sep 1, 2020 |
Notable patents
Publications ranked by popularity score, then publication date.
RFID tag and RFID system
US-10657337-B2 · May 19, 2020 · US
Power module substrate, power module, and method for manufacturing power module substrate
US-2019181066-A1 · Jun 13, 2019 · US
Rfid tag and rfid system
US-2019163939-A1 · May 30, 2019 · US
Circuit board and electronic device
US-10037928-B2 · Jul 31, 2018 · US
Circuit board having a heat dissipating sheet with varying metal grain size
US-10014237-B2 · Jul 3, 2018 · US
Circuit board and electronic device
US-2018005914-A1 · Jan 4, 2018 · US
Circuit board and electronic device
US-2017352607-A1 · Dec 7, 2017 · US
Recent patents
Latest publications not already listed above.
No data yet.
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Kyocera Corp | 8 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W40/255 | 6 |
| H10W40/10 | 6 |
| H01L23/3735 | 5 |
| H10W70/6875 | 4 |
| H10W40/22 | 4 |