Rfid tag and rfid system

Patent metadata

Field	Value
Publication number	US-2019163939-A1
Application number	US-201716092800-A
Country	US
Kind code	A1
Filing date	Apr 11, 2017
Priority date	Apr 13, 2016
Publication date	May 30, 2019
Grant date	—

Abstract

An RFID tag in the present disclosure includes an insulating substrate including an upper surface, a coil conductor disposed in the insulating substrate, a semiconductor element mounted on the upper surface of the insulating substrate, and a mold resin covering the upper surface of the insulating substrate and the semiconductor element. The mold resin contains a plurality of magnetic particles having particle sizes different from each other.

First claim

1 . An RFID tag comprising:
an insulating substrate with an upper surface; a coil conductor in the insulating substrate; a semiconductor element on the upper surface of the insulating substrate; and a mold resin covering the upper surface of the insulating substrate and the semiconductor element, wherein the mold resin contains a plurality of magnetic particles having particle sizes different from each other.

2 . The RFID tag according to claim 1 , wherein
a content of the magnetic particles in the mold resin is higher in a lower part of the mold resin than in an upper part of the mold resin.

3 . The RFID tag according to claim 2 , wherein
the flat-shaped magnetic particles comprise magnetic particles, and the flat-shaped magnetic particles are disposed with a flat surface extending along the upper surface of the insulating substrate.

4 . The RFID tag according to claim 3 , wherein
a ratio of the flat-shaped magnetic particles to the magnetic particles is higher in the lower part of the mold resin than in the upper part of the mold resin.

5 . The RFID tag according to claim 2 , wherein
the magnetic particles comprise hollow magnetic particles.

6 . The RFID tag according to claim 5 , wherein
a ratio of the hollow magnetic particles to the magnetic particles is higher in the upper part of the mold resin than in the lower part of the mold resin.

7 . The RFID tag according to claim 2 , further comprising:
a terminal on the upper surface of the insulating substrate, electrically connected to the coil conductor, and electrically connected to the semiconductor element via a bonding wire.

8 . An RFID system comprising:
the RFID tag according to claim 2 ; and a reader/writer comprising an antenna facing the coil conductor of the RFID tag.

9 . The RFID tag according to claim 3 , wherein
the magnetic particles comprise hollow magnetic particles.

10 . The RFID tag according to claim 3 , further comprising:
a terminal on the upper surface of the insulating substrate, electrically connected to the coil conductor, and electrically connected to the semiconductor element via a bonding wire.

11 . The RFID tag according to claim 4 , wherein
the magnetic particles comprise hollow magnetic particles.

12 . The RFID tag according to claim 4 , further comprising:
a terminal on the upper surface of the insulating substrate, electrically connected to the coil conductor, and electrically connected to the semiconductor element via a bonding wire.

13 . The RFID tag according to claim 5 , further comprising:
a terminal on the upper surface of the insulating substrate, electrically connected to the coil conductor, and electrically connected to the semiconductor element via a bonding wire.

14 . The RFID tag according to claim 6 , further comprising:
a terminal on the upper surface of the insulating substrate, electrically connected to the coil conductor, and electrically connected to the semiconductor element via a bonding wire.

15 . The RFID tag according to claim 9 , wherein
a ratio of the hollow magnetic particles to the magnetic particles is higher in the upper part of the mold resin than in the lower part of the mold resin.

16 . The RFID tag according to claim 9 , further comprising:
a terminal on the upper surface of the insulating substrate, electrically connected to the coil conductor, and electrically connected to the semiconductor element via a bonding wire.

17 . The RFID tag according to claim 1 , wherein
the magnetic particles comprise flat-shaped magnetic particles, the flat-shaped magnetic particles are disposed with a flat surface extending along the upper surface of the insulating substrate, and a ratio of the flat-shaped magnetic particles to the magnetic particles is higher in the lower part of the mold resin than in the upper part of the mold resin.

18 . The RFID tag according to claim 1 , wherein
the magnetic particles comprise hollow magnetic particles, and a ratio of the hollow magnetic particles to the magnetic particles is higher in the upper part of the mold resin than in the lower part of the mold resin.

19 . The RFID tag according to claim 17 , further comprising:
a terminal on the upper surface of the insulating substrate, electrically connected to the coil conductor, and electrically connected to the semiconductor element via a bonding wire.

20 . The RFID tag according to claim 18 , further comprising:
a terminal on the upper surface of the insulating substrate, electrically connected to the coil conductor, and electrically connected to the semiconductor element via a bonding wire.

Assignees

• Kyocera Corp

Inventors

• Yamamoto Shuuichi
• Ochiai Kensou

Classifications

• H01F38/14

  Inductive couplings {(for wireless supply or distribution of electric power using inductive coupling H02J50/10)} · CPC title

• G06K19/02

  characterised by the selection of materials, e.g. to avoid wear during transport through the machine · CPC title

• G06K7/10316 Primary

  using at least one antenna particularly designed for interrogating the wireless record carriers (antennas in general H01Q1/22) · CPC title

• G06K19/07749 Primary

  the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card · CPC title

• H01F2027/2809

  on stacked layers · CPC title