RFID tag and RFID system

Patent metadata

Field	Value
Publication number	US-10657337-B2
Application number	US-201716092800-A
Country	US
Kind code	B2
Filing date	Apr 11, 2017
Priority date	Apr 13, 2016
Publication date	May 19, 2020
Grant date	May 19, 2020

Abstract

An RFID tag in the present disclosure includes an insulating substrate including an upper surface, a coil conductor disposed in the insulating substrate, a semiconductor element mounted on the upper surface of the insulating substrate, and a mold resin covering the upper surface of the insulating substrate and the semiconductor element. The mold resin contains a plurality of magnetic particles having particle sizes different from each other.

First claim

The invention claimed is:

1. An RFID tag comprising:
an insulating substrate with an upper surface;
a coil conductor in the insulating substrate;
a semiconductor element on the upper surface of the insulating substrate; and
a mold resin covering the upper surface of the insulating substrate and the semiconductor element, wherein
the mold resin contains a plurality of magnetic particles having particle sizes different from each other, and
a content of the magnetic particles in the mold resin is higher in a lower part of the mold resin than in an upper part of the mold resin.

2. The RFID tag according to claim 1 , wherein
the magnetic particles comprise flat-shaped magnetic particles, and
the flat-shaped magnetic particles are disposed with a flat surface extending along the upper surface of the insulating substrate.

3. The RFID tag according to claim 2 , wherein
a ratio of the flat-shaped magnetic particles to the magnetic particles is higher in the lower part of the mold resin than in the upper part of the mold resin.

4. The RFID tag according to claim 2 , wherein
the magnetic particles comprise hollow magnetic particles.

5. The RFID tag according to claim 4 , wherein
a ratio of the hollow magnetic particles to the magnetic particles is higher in the upper part of the mold resin than in the lower part of the mold resin.

6. The RFID tag according to claim 4 , further comprising:
a terminal on the upper surface of the insulating substrate, electrically connected to the coil conductor, and electrically connected to the semiconductor element via a bonding wire.

7. The RFID tag according to claim 2 , further comprising:
a terminal on the upper surface of the insulating substrate, electrically connected to the coil conductor, and electrically connected to the semiconductor element via a bonding wire.

8. The RFID tag according to claim 3 , wherein
the magnetic particles comprise hollow magnetic particles.

9. The RFID tag according to claim 3 , further comprising:
a terminal on the upper surface of the insulating substrate, electrically connected to the coil conductor, and electrically connected to the semiconductor element via a bonding wire.

10. The RFID tag according to claim 1 , wherein
the magnetic particles comprise hollow magnetic particles.

11. The RFID tag according to claim 10 , wherein
a ratio of the hollow magnetic particles to the magnetic particles is higher in the upper part of the mold resin than in the lower part of the mold resin.

12. The RFID tag according to claim 10 , further comprising:
a terminal on the upper surface of the insulating substrate, electrically connected to the coil conductor, and electrically connected to the semiconductor element via a bonding wire.

13. The RFID tag according to claim 11 , further comprising:
a terminal on the upper surface of the insulating substrate, electrically connected to the coil conductor, and electrically connected to the semiconductor element via a bonding wire.

14. The RFID tag according to claim 1 , further comprising:
a terminal on the upper surface of the insulating substrate, electrically connected to the coil conductor, and electrically connected to the semiconductor element via a bonding wire.

15. An RFID system comprising:
the RFID tag according to claim 1 ; and
a reader/writer comprising an antenna facing the coil conductor of the RFID tag.

16. The RFID tag according to claim 1 , wherein
the magnetic particles comprise flat-shaped magnetic particles,
the flat-shaped magnetic particles are disposed with a flat surface extending along the upper surface of the insulating substrate, and
a ratio of the flat-shaped magnetic particles to the magnetic particles is higher in the lower part of the mold resin than in the upper part of the mold resin.

17. The RFID tag according to claim 16 , further comprising:
a terminal on the upper surface of the insulating substrate, electrically connected to the coil conductor, and electrically connected to the semiconductor element via a bonding wire.

18. The RFID tag according to claim 1 , wherein
the magnetic particles comprise hollow magnetic particles, and
a ratio of the hollow magnetic particles to the magnetic particles is higher in the upper part of the mold resin than in the lower part of the mold resin.

19. The RFID tag according to claim 18 , further comprising:
a terminal on the upper surface of the insulating substrate, electrically connected to the coil conductor, and electrically connected to the semiconductor element via a bonding wire.

Assignees

• Kyocera Corp

Inventors

• Yamamoto Shuuichi
• Ochiai Kensou

Classifications

• H01F38/14

  Inductive couplings {(for wireless supply or distribution of electric power using inductive coupling H02J50/10)} · CPC title

• G06K19/07749 Primary

  the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card · CPC title

• G06K7/10316 Primary

  using at least one antenna particularly designed for interrogating the wireless record carriers (antennas in general H01Q1/22) · CPC title

• G06K19/02

  characterised by the selection of materials, e.g. to avoid wear during transport through the machine · CPC title

• G06K19/077

  Constructional details, e.g. mounting of circuits in the carrier · CPC title