Differential contrast plating for advanced packaging applications
US-12559853-B2 · Feb 24, 2026 · US
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Oberst Justin patents
Oberst Justin is listed as an inventor on 16 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Oberst Justin |
| Total patents | 16 |
| First publication | Aug 24, 2017 |
| Latest publication | Feb 24, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Low temperature direct copper-copper bonding
US-12424453-B2 · Sep 23, 2025 · US
Lipseal edge exclusion engineering to maintain material integrity at wafer edge
US-12247310-B2 · Mar 11, 2025 · US
Temporary capping material for oxide prevention in low temperature direct metal-metal bonding
US-2024312778-A1 · Sep 19, 2024 · US
Surface pretreatment for electroplating nanotwinned copper
US-2023212773-A1 · Jul 6, 2023 · US
Lipseal edge exclusion engineering to maintain material integrity at wafer edge
US-2023167571-A1 · Jun 1, 2023 · US
Alternative integration for redistribution layer process
US-11450631-B2 · Sep 20, 2022 · US
Differential contrast plating for advanced packaging applications
US-2022275531-A1 · Sep 1, 2022 · US
Low temperature direct copper-copper bonding
US-2022018036-A1 · Jan 20, 2022 · US
Electrodeposition of nanotwinned copper structures
US-2022010446-A1 · Jan 13, 2022 · US
Recent patents
Latest publications not already listed above.
Alternative integration for redistribution layer process
US-2021193514-A1 · Jun 24, 2021 · US
Methods and apparatus for flow isolation and focusing during electroplating
US-11001934-B2 · May 11, 2021 · US
Systems and methods for achieving uniformity across a redistribution layer
US-10714436-B2 · Jul 14, 2020 · US
System and method for chemical and heated wetting of substrates prior to metal plating
US-2020035484-A1 · Jan 30, 2020 · US
Methods and apparatus for flow isolation and focusing during electroplating
US-2019055665-A1 · Feb 21, 2019 · US
Systems and methods for achieving uniformity across a redistribution layer
US-2017243839-A1 · Aug 24, 2017 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Lam Res Corp | 16 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| C25D7/123 | 13 |
| C25D17/001 | 12 |
| H10W72/012 | 9 |
| H10W72/01235 | 8 |
| H10W70/05 | 8 |