Three-dimensional flat memory device including a dual dipole blocking dielectric layer and methods of making the same
US-11631691-B2 · Apr 18, 2023 · US
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Nishikawa Masatoshi patents
Nishikawa Masatoshi is listed as an inventor on 88 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Nishikawa Masatoshi |
| Total patents | 88 |
| First publication | Dec 1, 2016 |
| Latest publication | Apr 18, 2023 |
Notable patents
Publications ranked by popularity score, then publication date.
Bonded die assembly using a face-to-back oxide bonding and methods for making the same
US-11587943-B2 · Feb 21, 2023 · US
Sub-block size reduction for 3D non-volatile memory
US-11404122-B2 · Aug 2, 2022 · US
Three-dimensional memory device containing inter-select-gate electrodes and methods of making the same
US-11222954-B2 · Jan 11, 2022 · US
Double write/read throughput by CMOS adjacent array (CaA) NAND memory
US-11189335-B2 · Nov 30, 2021 · US
Three-dimensional memory device containing inter-select-gate electrodes and methods of making the same
US-2021305384-A1 · Sep 30, 2021 · US
Three-dimensional memory device including different height memory stack structures and methods of making the same
US-11094715-B2 · Aug 17, 2021 · US
Non-volatile memory array driven from both sides for performance improvement
US-11081185-B2 · Aug 3, 2021 · US
Three-dimensional phase change memory device including vertically constricted current paths and methods of manufacturing the same
US-11043537-B2 · Jun 22, 2021 · US
Three-dimensional flat NAND memory device having curved memory elements and methods of making the same
US-11024635-B2 · Jun 1, 2021 · US
Recent patents
Latest publications not already listed above.
Parallel memory operations in multi-bonded memory device
US-11024385-B2 · Jun 1, 2021 · US
Double write/read throughput by caa nand
US-2021142841-A1 · May 13, 2021 · US
Three-dimensional memory device having enhanced contact between polycrystalline channel and epitaxial pedestal structure and method of making the same
US-10991705-B2 · Apr 27, 2021 · US
Three-dimensional memory device having enhanced contact between polycrystalline channel and epitaxial pedestal structure and method of making the same
US-10991706-B2 · Apr 27, 2021 · US
Three-dimensional memory device including laterally constricted current paths and methods of manufacturing the same
US-10964752-B2 · Mar 30, 2021 · US
Sub-block size reduction for 3d non-volatile memory
US-2021082506-A1 · Mar 18, 2021 · US
Three-dimensional flat NAND memory device having curved memory elements and methods of making the same
US-10930674-B2 · Feb 23, 2021 · US
Three-dimensional memory device having enhanced contact between polycrystalline channel and epitaxial pedestal structure and method of making the same
US-2021035999-A1 · Feb 4, 2021 · US
Three-dimensional memory device having enhanced contact between polycrystalline channel and epitaxial pedestal structure and method of making the same
US-2021035998-A1 · Feb 4, 2021 · US
Sub-block size reduction for 3D non-volatile memory
US-10878907-B1 · Dec 29, 2020 · US
Bonded die assembly using a face-to-back oxide bonding and methods for making the same
US-2020402990-A1 · Dec 24, 2020 · US
Non-volatile memory array driven from both sides for performance improvement
US-2020402587-A1 · Dec 24, 2020 · US
Three-dimensional phase change memory device including vertically constricted current paths and methods of manufacturing the same
US-2020395407-A1 · Dec 17, 2020 · US
Three-dimensional memory device including laterally constricted current paths and methods of manufacturing the same
US-2020395408-A1 · Dec 17, 2020 · US
Sub-block size reduction for 3d non-volatile memory
US-2020388335-A1 · Dec 10, 2020 · US
Three-dimensional memory device containing bit line switches
US-10854619-B2 · Dec 1, 2020 · US
Parallel memory operations in multi-bonded memory device
US-2020365210-A1 · Nov 19, 2020 · US
Three-dimensional memory device including different height memory stack structures and methods of making the same
US-2020335518-A1 · Oct 22, 2020 · US
Bonded die assembly using a face-to-back oxide bonding and methods for making the same
US-2020335512-A1 · Oct 22, 2020 · US
Bonded die assembly using a face-to-back oxide bonding and methods for making the same
US-10797062-B1 · Oct 6, 2020 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Sandisk Technologies Llc | 75 |
| Sandisk Technologies Inc | 16 |
| Western Digital Tech Inc | 4 |
| Noguchi Yoshihiro | 1 |
| Hiroshima Atsushi | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10B43/27 | 83 |
| H01L27/11582 | 76 |
| H10B41/27 | 66 |
| H10B43/35 | 64 |
| H01L27/11556 | 60 |