Light Projector Module with Directly Bonded and Orthogonal Rigid Components
US-2025328010-A1 · Oct 23, 2025 · US
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Nagarajan Kumar patents
Nagarajan Kumar is listed as an inventor on 19 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Nagarajan Kumar |
| Total patents | 19 |
| First publication | Apr 23, 2015 |
| Latest publication | Oct 23, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
System packaging for cellular modem and transceiver system of heterogeneous stacking
US-2025286027-A1 · Sep 11, 2025 · US
Molded Silicon on Passive Package
US-2025183127-A1 · Jun 5, 2025 · US
System packaging for cellular modem and transceiver system of heterogeneous stacking
US-12315853-B2 · May 27, 2025 · US
Electronic Package Molded Vertical Interconnection
US-2025096096-A1 · Mar 20, 2025 · US
Molded silicon on passive package
US-12165956-B2 · Dec 10, 2024 · US
System packaging for cellular modem and transceiver system of heterogeneous stacking
US-2023238365-A1 · Jul 27, 2023 · US
Molded Silicon on Passive Package
US-2023178458-A1 · Jun 8, 2023 · US
Structure and method for hybrid optical package with glass top cover
US-10461066-B2 · Oct 29, 2019 · US
Structure and method for hybrid optical package with glass top cover
US-2018006003-A1 · Jan 4, 2018 · US
Recent patents
Latest publications not already listed above.
Optical sensor having a light emitter and a photodetector assembly directly mounted to a transparent substrate
US-9627573-B2 · Apr 18, 2017 · US
Embedded die redistribution layers for active device
US-9443815-B2 · Sep 13, 2016 · US
Sacrificial pad on semiconductor package device and method
US-9397027-B1 · Jul 19, 2016 · US
Wafer level lens in package
US-9354111-B2 · May 31, 2016 · US
Lid assembly for thermopile temperature sensing device in thermal gradient environment
US-2015380627-A1 · Dec 31, 2015 · US
Stacked LED for optical sensor devices
US-9136258-B1 · Sep 15, 2015 · US
Embedded die redistribution layers for active device
US-2015243590-A1 · Aug 27, 2015 · US
Optical sensor having a light emitter and a photodetector assembly directly mounted to a transparent substrate
US-2015243824-A1 · Aug 27, 2015 · US
Wafer level lens in package
US-2015109785-A1 · Apr 23, 2015 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Maxim Integrated Products | 10 |
| Apple Inc | 8 |
| Qualcomm Technologies Inc | 1 |
| Maxim Integreated Products Inc | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/00 | 12 |
| H10W42/20 | 6 |
| H10W90/722 | 5 |
| H10W70/65 | 4 |
| H10W74/114 | 4 |