System packaging for cellular modem and transceiver system of heterogeneous stacking

Patent metadata

Field	Value
Publication number	US-12315853-B2
Application number	US-202217582870-A
Country	US
Kind code	B2
Filing date	Jan 24, 2022
Priority date	Jan 24, 2022
Publication date	May 27, 2025
Grant date	May 27, 2025

Abstract

A radio frequency package includes a baseband processor, a transceiver, and a memory. The baseband processor performs processing for wireless communication functions. Moreover, the transceiver transmits and receives wireless signals based on the processing of the wireless communication functions. Additionally, the memory is associated with the baseband processor and stores instructions for performing the processing. The memory and the baseband processor are disposed on top of the transceiver.

First claim

The invention claimed is:

1. A radio frequency package, comprising:
a baseband processor configured to perform processing for wireless communication functions;
a transceiver configured to transmit and receive wireless signals based on the processing of the wireless communication functions;
a plurality of through mold vias; and
a memory associated with the baseband processor, the memory configured to store instructions for performing the processing, wherein the memory and the baseband processor are laterally adjacent in a same layer of the radio frequency package and disposed on top of the transceiver and the plurality of through mold vias in the radio frequency package.

2. The radio frequency package of claim 1 , comprising a thermal gel configured to dissipate heat, the thermal gel disposed on top of the memory, the baseband processor, or both.

3. The radio frequency package of claim 1 , comprising a dummy die configured to absorb heat, the dummy die disposed on top of the memory, the baseband processor, or both.

4. The radio frequency package of claim 1 , wherein a top side of the memory, the baseband processor, or both, is an exposed die.

5. The radio frequency package of claim 1 , wherein the transceiver is disposed between a first redistribution layer and a second redistribution layer, and wherein the first redistribution layer and the second redistribution layer provide signal routing, shielding from noise, or both.

6. The radio frequency package of claim 1 , comprising a plurality of decoupling capacitors disposed on either side of the baseband processor, the plurality of decoupling capacitors are wire bonded and configured to filter noise from the baseband processor.

7. The radio frequency package of claim 1 , comprising a continuous shielding of conformal shielding disposed around exposed sides of the transceiver.

8. The radio frequency package of claim 1 , comprising a semi-continuous shielding around the transceiver, wherein the semi-continuous shielding comprises conformal shielding along at least a first exposed side of the transceiver and at least one through mold via of the plurality of through mold vias along at least a second exposed side of the transceiver.

9. The radio frequency package of claim 1 , wherein the plurality of through mold vias are disposed along each exposed side of the baseband processor, the memory, or both.

10. The radio frequency package of claim 9 , wherein a first portion of the plurality of through mold vias are disposed relatively closer to the baseband processor, the memory, or both, wherein a second portion of the plurality of through mold vias are disposed relatively further from the baseband processor, the memory, or both, and wherein the first portion is configured to provide shielding from noise and the second portion is configured to route signals.

11. A stacked system package, comprising:
a first layer comprising a shielding layer configured to absorb electromagnetic waves;
a second layer disposed on top of the first layer, the second layer comprising:
a transceiver configured to transmit and receive wireless signals; and
a plurality of through mold vias configured to route signals, provide shielding, or both;

a third layer disposed on top of the second layer, the third layer comprising:
a baseband processor configured to process radio frequency functions; and
a memory configured to store instructions for performing the process; and

a fourth layer disposed on top of the third layer, the fourth layer comprising a thermal gel configured to dissipate heat.

12. The stacked system package of claim 11 , wherein the baseband processor generates heat that flows from the third layer to the second layer, the first layer, or both.

13. The stacked system package of claim 12 , wherein the plurality of through mold vias absorb or dissipate the heat.

14. The stacked system package of claim 11 , wherein the third layer comprises passive devices, the passive devices disposed laterally adjacent to the memory and the baseband processor.

15. The stacked system package of claim 11 , wherein the plurality of through mold vias are configured to function as power buses.

16. The stacked system package of claim 11 , wherein signals flow top-down from the third layer to the second layer, from the second layer to the first layer, or both.

17. A radio frequency package, comprising:
a baseband chip configured to perform processing for wireless communication functions;
a radio frequency chip configured to transmit and receive wireless signals based on the processing of the wireless communication functions;
a memory chip associated with the baseband chip, the memory chip configured to store instructions for performing the processing, wherein the memory chip is disposed on top of the baseband chip, wherein the baseband chip, the radio frequency chip, and the memory chip are disposed in a same mold layer of the radio frequency package; and
a shielding layer separate from and vertically adjacent to the same mold layer.

18. The radio frequency package of claim 17 , wherein the radio frequency chip is integrated with the baseband chip into a single chip.

19. The radio frequency package of claim 18 , wherein the memory chip is bonded by a wire to the shielding layer, wherein the wire provides shielding and interconnections within the radio frequency package.

20. The radio frequency package of claim 17 , comprising a partial through mold via disposed in the same mold layer of the radio frequency package and configured to shield the radio frequency chip from noise generated from the baseband chip, the memory chip, or both.

Assignees

• Apple Inc

Inventors

• Dalmia Sidharth S
• Nagarajan Kumar

Classifications

• H10W90/722

  between stacked chips · CPC title

• H10W90/288

  characterised by arrangements for thermal management of the stacked chips · CPC title

• H10W70/60

  Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) · CPC title

• H10W42/20

  protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons · CPC title

• H10W90/701

  characterised by the relative positions of pads or connectors relative to package parts · CPC title