Semiconductor package
US-11742329-B2 · Aug 29, 2023 · US
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Mok Seungkon patents
Mok Seungkon is listed as an inventor on 9 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Mok Seungkon |
| Total patents | 9 |
| First publication | Apr 26, 2016 |
| Latest publication | Aug 29, 2023 |
Notable patents
Publications ranked by popularity score, then publication date.
Semiconductor package
US-2021375831-A1 · Dec 2, 2021 · US
Semiconductor package
US-11101243-B2 · Aug 24, 2021 · US
Semiconductor package
US-2020350288-A1 · Nov 5, 2020 · US
Semiconductor packages and methods of fabricating the same
US-2018269126-A1 · Sep 20, 2018 · US
Packaged semiconductor chips having heat dissipation layers and ground contacts therein
US-9978661-B2 · May 22, 2018 · US
Semiconductor package including image sensor and holder with transparent cover and adhesive stopper
US-9640575-B2 · May 2, 2017 · US
Semiconductor package and method of manufacturing the same
US-2016218130-A1 · Jul 28, 2016 · US
Semiconductor package including an image sensor and a holder with stoppers
US-9324748-B2 · Apr 26, 2016 · US
Recent patents
Latest publications not already listed above.
No data yet.
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Samsung Electronics Co Ltd | 9 |
| Im Yunhyeok | 1 |
| Feygenson Oleg | 1 |
| Kim Sang Il | 1 |
| Kim Youngbae | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/754 | 9 |
| H10W90/734 | 9 |
| H10W72/884 | 9 |
| H01L2224/48227 | 8 |
| H10W90/724 | 6 |